Category Archives: IPC

Dual-Use Export Controls Regulation: One to Watch for the Electronics Industry

The European Union is currently working to update its legislation on export controls for dual-use items, meaning items that can be used for both civilian and military applications and/or can contribute to the proliferation of Weapons of Mass Destruction (WMD). Most importantly, the proposal for an updated Regulation introduces the following changes: • Expansion of […]

IPC is Seeking Participants for Technical Education Program Committee

IPC is seeking volunteers who represent all segments of the electronics manufacturing industry, for our Technical Education Program Committee, to help guide, create and develop high-quality educational programs through conferences, tutorials and workshops. This is a great opportunity to collaborate with your industry colleagues and to become more involved with IPC. For more information, contact […]

Don Dupriest Elected to Chair Top IPC Standards Leadership Committee

Don Dupriest, Lockheed Martin Missiles & Fire Control, has been elected chair of the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Dupriest succeeds Chris Mahanna of Robisan Laboratory, Inc., who held the role for IPC’s top standards development oversight committee for the past two years. As a Lockheed Martin Fellow on Lockheed […]

In Memoriam – Brian Butler

It is with deep sadness that IPC announces the death of one of its valued committee members and leaders, Brian Butler, president and CEO of Introbotix, Corp. Brian passed away on March 11, 2018. Brian joined the IPC D-21c High Speed/High Frequency Controlled Impedance Task Group in early 2000. He volunteered for numerous IPC task […]

What Happens to our Industry Without a Skilled Workforce?

IPC president and CEO John Mitchell discusses the skills gap in the manufacturing industry and IPC’s efforts to address the issue.

IPC Publishes New Standard on Low Pressure Molding for Circuitry Encapsulation

IPC-7621 offers cost-effect alternative to potting IPC announces a new standard, IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics, a guidance document that offers instruction on using Low Pressure Molding (LPM) in place of potting for circuitry encapsulation. Unlike potting, where the […]

What’s New in IPC Government Relations

IPC President and CEO John Mitchell and IPC Vice President of Global Government Relations Chris Mitchell talk to PCB Chat host and Circuits Assembly and Printed Circuit Design & Fab Editor-in-Chief Mike Buetow about key government programs and initiatives and why it’s important for members to participate in lobbying efforts. Listen to podcast: https://upmg.podbean.com/e/pcb-chat-episode-12-john-mitchell-and-chris-mitchell/   […]

Successful Outreach Program in the EU Paves the Way for IMPACT Europe 2018

By Ken Schramko, Director, Government Relations IPC’s advocacy efforts in Europe have grown significantly over the past few years. At this stage, we are not only raising awareness for the needs of the electronics industry but also advancing the interests of our members through face-to-face meetings with Members of the European Parliament (MEPs), high-level officials […]

What Will You Discover at IPC APEX EXPO 2018?

John Mitchell, IPC president and CEO, extends a special invitation to IPC APEX EXPO 2018.

In Search of High Reliability in Printed Board Fabrication for Medical Device Applications

By John Perry, Director of Printed Board Standards & Technology It has been well known that for many years IPC has provided a trio of performance classifications in its suite of standards and specifications for the design, fabrication, assembly and acceptance of printed boards and printed board assemblies. Intended to reflect differences in producibility, complexity, […]