Category Archives: IPC

Where Can you Find a Suitable Surface Finish for 5G, High Frequency, and High-Density Applications?

By Kunil Shah, Ph.D., chief scientist, LiloTree The advent and ongoing evolution of internet-enabled mobile devices has continued to drive innovation in the manufacturing and design of technology capable of high-frequency/high-density electronic signal transfer. The combined requirements for both fast, always-on data transmission, and small geometric form-factors can be difficult to satisfy without compromised performance […]

Three Workforce Lessons from Manufacturing Plants Around the World

By John Mitchell, IPC president and CEO The U.S. economy has remained surprisingly resilient, and the result has been that the country’s unemployment has continued to inch lower. It’s now at 3.5 percent, the lowest rate since 1969, and that rate could go even lower as the U.S. boasts more than 7 million job openings. […]

U.S. Congress to Approve Funds for R&D on Lead-free Electronics in Aerospace, Defense and High-performance Applications

In a win for U.S. taxpayers, defense readiness, and the electronics industry supply chain, the U.S. House and Senate are poised this week to approve a defense spending bill that includes $5 million for research and development on the issues surrounding lead-free electronics in mission-critical applications. IPC and dozens of its members and allies supported […]

U.S. Congress to Approve Funds for R&D on Lead-Free Electronics and Defense

By Chris Mitchell, vice president, global government relations In a win for U.S. taxpayers, defense readiness, and the electronics industry supply chain, the U.S. House and Senate are poised this week to approve a defense spending bill that includes $5 million for research and development on the issues surrounding lead-free electronics in mission-critical applications. President […]

Ceasefire Announced in U.S.-China Trade War

By Chris Mitchell, vice president, global government relations On Friday, December 13, the United States and China announced they had struck a “phase one” deal that effectively pauses the trade war that has flared between the countries over the last two years. The Trump administration says the deal “requires structural reforms and other changes to […]

IPC Welcomes U.S.–China Phase One Deal

The following statement can be attributed to John Mitchell, IPC president and CEO: “The electronics manufacturing industry welcomes the announcement that the United States and China have agreed to a “phase one” trade deal bolstering enforcement of China’s intellectual property laws and rolling back or postponing retaliatory tariffs on thousands of goods traded between them. […]

Rising Tariffs Put a Painful Squeeze on Electronics Manufacturing

To determine the effects the U.S./China tariff dispute has on U.S. electronics manufacturers, IPC conducted a survey of its U.S. members. The results reflect how difficult it is for a global industry to navigate this uncertainty. IPC President and CEO John Mitchell provides details in his monthly IPC president’s message.

IMPACT Europe 2019: IPC Members Call for Pro-manufacturing Policies to Strengthen the Competitiveness of the European Electronics Value Chain

Representatives of electronics companies from across Europe gathered last week in Brussels to call on European policy makers to ensure the right policy and regulatory environment to stimulate innovation in the electronics value chain and boost its competitiveness in Europe. Held annually, IMPACT Europe is our premier annual advocacy event in Brussels, giving IPC members […]

In Memoriam – Bernie Kessler

It is with deep sadness that IPC announces the passing of electronics industry pioneer and IPC Hall of Famer, Bernard (Bernie) Kessler. Bernie passed away on December 2, 2019 at age 96. Active in IPC for more than 50 years, Bernie served as IPC’s first chair of the Technical Activities Executive Council (TAEC). He earned […]

Technology Spotlight: How Semi-Additive Processes Enable Finer Circuit Features

By Tara Dunn, president, Omni PCB Can you imagine the benefits of routing with a 25-micron trace and space? Just to name a few; complex pin outs would require fewer layers and a decrease in costly lamination cycles, the overall size of the PCB could be dramatically reduced, or conversely, additional electronics could be fit […]