Category Archives: IPC

IMPACT Washington, D.C. 2018: Electronics Industry Leaders Urge Policymakers to Support Pro-Electronics Agenda

As an industry-driven association, IPC exists to help its member companies innovate, compete, and succeed in the electronics industry. Effective government relations is crucial to our collective success, because many of the policy debates taking place in world capitals have wide-reaching impacts on our industry. That’s why senior executives from top electronics companies recently gathered […]

President Trump Announces 25 Percent Tariff Imposition on Chinese Imports

Today, President Trump announced that he will impose 25 percent tariffs on Chinese imports worth roughly $50 billion. The tariffs, first proposed in April, are the result of a Section 301 investigation that found China’s technology transfer policies had harmed U.S. companies. The first round of these tariffs will take effect July 6 and will […]

IPC Automotive Electronics Reliability Forum Highlights Future of Automotive Electronics Design and Manufacturing

Fueled by strong growth in electric vehicles and autonomous cars, and a dramatic increase in electronics content in conventional automobiles and trucks, automotive electronics are crucial components of engine, ignition, and transmission management; entertainment, navigation, diagnostic tools and safety systems. IPC has gathered thought leaders and subject matter experts from leading electronics and automotive companies […]

IPC Members: Your Voice is Needed in Washington, D.C. on May 21-23

Your presence is needed in Washington, D.C. Hearing from constituents like you, whose businesses are affected by their decisions, can have a significant impact upon policymakers. The more executives our industry can rally, the stronger our collective voice will be and the more likely we will have a positive impact. You can register for IMPACT […]

Dual-Use Export Controls Regulation: One to Watch for the Electronics Industry

The European Union is currently working to update its legislation on export controls for dual-use items, meaning items that can be used for both civilian and military applications and/or can contribute to the proliferation of Weapons of Mass Destruction (WMD). Most importantly, the proposal for an updated Regulation introduces the following changes: • Expansion of […]

IPC is Seeking Participants for Technical Education Program Committee

IPC is seeking volunteers who represent all segments of the electronics manufacturing industry, for our Technical Education Program Committee, to help guide, create and develop high-quality educational programs through conferences, tutorials and workshops. This is a great opportunity to collaborate with your industry colleagues and to become more involved with IPC. For more information, contact […]

Don Dupriest Elected to Chair Top IPC Standards Leadership Committee

Don Dupriest, Lockheed Martin Missiles & Fire Control, has been elected chair of the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Dupriest succeeds Chris Mahanna of Robisan Laboratory, Inc., who held the role for IPC’s top standards development oversight committee for the past two years. As a Lockheed Martin Fellow on Lockheed […]

In Memoriam – Brian Butler

It is with deep sadness that IPC announces the death of one of its valued committee members and leaders, Brian Butler, president and CEO of Introbotix, Corp. Brian passed away on March 11, 2018. Brian joined the IPC D-21c High Speed/High Frequency Controlled Impedance Task Group in early 2000. He volunteered for numerous IPC task […]

What Happens to our Industry Without a Skilled Workforce?

IPC president and CEO John Mitchell discusses the skills gap in the manufacturing industry and IPC’s efforts to address the issue.

IPC Publishes New Standard on Low Pressure Molding for Circuitry Encapsulation

IPC-7621 offers cost-effect alternative to potting IPC announces a new standard, IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics, a guidance document that offers instruction on using Low Pressure Molding (LPM) in place of potting for circuitry encapsulation. Unlike potting, where the […]