Category Archives: IMAPS

IPC Members Invited to Chicago-Milwaukee IMAPS Chapter Event

IPC Members are Invited to Participate   IMAPS Chicago-Milwaukee Chapter Industry Lunch, Facility Tour, and Presentations Material & Process Advancements Tuesday, August 14 in Palatine, IL Program:  11:30 Registration and Networking 12:00 Lunch and Chapter Announcements 12:45 “Palladium Copper and Silver Alloy Bonding Wire.” William Crockett, Business Development Manager at Tanaka Kikinzoku International (America) 1:15 “High […]