Category Archives: Design

IPC and ITI Convene Experts and Members to Examine Critical Environmental Requirements for Electronics

June 17, 2020 – 4:14 pm

Kelly Scanlon, IPC director of environment, health and safety policy and research Last Tuesday, June 9, IPC partnered with the Information Technology Industry Council (ITI) to offer an educational conference for the electronics sector on critical environmental requirements. Previous conferences entailed a cross-country roadshow including stops in multiple cities from the East to West coasts. […]

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Technology Spotlight: How Semi-Additive Processes Enable Finer Circuit Features

November 25, 2019 – 10:32 am

By Tara Dunn, president, Omni PCB Can you imagine the benefits of routing with a 25-micron trace and space? Just to name a few; complex pin outs would require fewer layers and a decrease in costly lamination cycles, the overall size of the PCB could be dramatically reduced, or conversely, additional electronics could be fit […]

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IPC Standards Committee Reports — Printed Board Design, Cleaning & Coating, Testing, Process Control, Product Assurance

May 7, 2015 – 2:31 pm

These standards committee reports from IPC APEX EXPO 2015 have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports. Printed Board Design The 1-10b Current Carrying Capacity Task Group met to discuss a replacement methodology for the legacy IPC-TM-650 Method 2.5.4.1, […]

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IPC-2231: The Cookbook for Design Excellence

January 31, 2015 – 3:08 pm

by:  Cheryl Tulkoff, CRE DfR Solutions Does your organization design for true excellence? Design for Excellence (DFX) is based upon the premise that getting product design right the first time is far less expensive than finding failures and fixing them in later product development. Do it right, do it light. Do it wrong, do it […]

By Cheryl Tulkoff | Also posted in IPC, Standards | Tagged , , , , , , | Leave a Comment

IPC Standards Committee Reports — Printed Board Design, Cleaning & Coating, Testing, Process Control, Product Assurance

November 7, 2014 – 10:32 am

These standards committee reports from the 2014 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports.  Printed Board Design The 1-10b Current Carrying Capacity Task Group met to discuss a roadmap for a revision of the […]

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The Road to DFX

September 8, 2014 – 7:52 pm

IPC President and CEO John Mitchell discusses a new IPC initiative: IPC DFX — Design for Excellence program and the advances the design community has seen over the years due to the leadership and contributions of the late, great Dieter Bergman.    

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IPC India PCB Design Contest Winner Showcases PCB Design Skills

June 12, 2014 – 8:37 am

Prevailing against other skilled PCB designers, Sakthivel Sivachandaran from Bloomenergy India PVT Ltd., took first place in IPC India’s PCB Design Contest on 19 May in Bangalore, India. As the first place winner, Sivachandaran won a complimentary registration to an IPC CID certification course. V. Shivakumar, Tessolve Services Pvt. Ltd., was the runner up and […]

By Sandy Gentry | Also posted in Boards, IPC, Technical | Tagged , | Leave a Comment

DFX or How I Learned How to Stop Worrying by Designing Reliability In

February 11, 2014 – 4:52 pm

One of the most useful things I’ve learned after spending more than 15 years as a process engineer is that assembly processes can easily make a design worse but they can never make it better. Decisions made early in the design phase ultimately predict final product success. Poor material choices, marginal suppliers, incorrect pad geometries […]

By Cheryl Tulkoff | Also posted in Assembly, IPC, Materials, Standards, Technical, Trade Show, Training | Tagged , , , , | Leave a Comment

Copper Pillar Packaging Development Poses Challenges, but Technology Helps Designers Increase Density

February 10, 2014 – 11:50 am

Designers of electronic products are always pushing to reduce size and weight while adding more functionality. That often puts them at the forefront of the evolution of high density chips and printed boards. Copper pillar micro bump technology is one of the favored chip-to-package interconnection methods, gradually taking the place of conventional techniques that use […]

By Terry Costlow | Also posted in Boards, electronics, IPC, Technical, Trade Show | Tagged , , , , , , | Leave a Comment

Simpler Sharing of Design Files is on the Horizon

November 25, 2013 – 10:21 am

Myriad acronyms segment the world of design tools: CAD, CAM, CAE and PLM to name a few. Whether the tools are computer-aided design/manufacturing/engineering or product lifecycle management, there’s a push to ensure that diverse design tools from multiple suppliers can communicate freely. At a recent PLM conference for Dassault Systèmes customers, speakers from many companies […]

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