Category Archives: Committees

Proposed IEC Standard on Halogen Free Raises Concerns

Like the game of whack-a-mole, the idea of a standard for low halogen electronics keeps popping up. Originally, proposed as an IPC specification of chlorine and bromine in copper-clad laminates, IEC 61249-2-21 was established many years ago to define FR-4 products for halogen-free. Then about a decade ago, concerns about certain toxic Br containing flame […]

IPC Standards Committee Reports — Base Materials, Assembly & Joining, Cleaning & Coating, Flex Circuits, High Speed/High Frequency

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the third in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully Balloted the Amendment 2 to the IPC-4101D-WAM1, Specification for Base Materials for Rigid and […]

IPC Standards Committee Reports — Assembly and Joining, Product Assurance

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Assembly and Joining The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the […]

IPC Standards Committee Reports — Packaged Electronic Components, Rigid Printed Boards, Embedded Devices, Printed Electronics, IP

IPC Standards Committee Reports These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports. Packaged Electronic Components The B-11 3-D Electronic Packages Subcommittee is making significant progress on the work draft […]

IPC Standards Committee Reports – Product Data, Shop Floor Communication, Supplier Declaration, EH&S, Conflict Minerals

These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the third in the series of reports. Product Data The 1-16 Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology (IPC-2581) Task Group met to review the changes […]

IPC Standards Committee Reports – Assembly and Joining, Component Traceability, Flexible Circuits, High Speed/High Frequency

These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Assembly and Joining The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the […]

IPC Standards Committee Reports – Printed Board Design, Cleaning & Coating, Testing, Process Control, Product Assurance

These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports. Printed Board Design The 1-10c Test Coupon and Artwork Generation Task Group announced the release of the IPC-2221B Gerber Coupon Generator. The […]

In Memoriam — Denny J. Cantwell

Long-time IPC member, Dennis (Denny) J. Cantwell, 74, passed away on November 12, 2015. Denny was a very active member of the IPC Flexible Circuits Base Materials Committee until his retirement from Printed Circuits Inc. in 2009. Denny will be missed by his former fellow committee members, IPC staff and his colleagues in the electronics […]

IPC Standards Committee Reports — Supplier Declaration, EH&S, Management, Embedded Devices, Printed Electronics, Conflict Minerals

These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports.   Supplier Declaration The 2-18h Conflict Minerals Declaration Task Group discussed potential future changes and enhancements to IPC-1755. […]

IPC Standards Committee Reports – Packaged Electronic Components, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards

These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the third in a series of reports.   Packaged Electronic Components The B-11 3-D Electronic Packages Subcommittee continued work on IPC-7091, Design and Assembly Process Implementation of […]