Category Archives: Committees

IPC Subcommittee to Host Open Forum on Weak Microvia Interface During IPC APEX EXPO

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee, formed this year, is working to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface. The activity grew out of the development of IPC-WP-023, a white […]

IPC to Host Web Meeting on Forming IPC E-Textiles Committee Europe Working Groups

By Chris Jorgensen, director, technology transfer IPC will host an open-invitation web meeting for European organizations involved in e-textiles technologies to form a working group or groups under the IPC D-70 E-Textiles Committee. As the D-70 Committee expands its standards development activities, IPC has received interest from committee members in Europe to form a local […]

IPC and AATCC to Host Joint Session at AATCC Committee Meetings

By Chris Jorgensen, director, IPC technology transfer IPC and the American Association of Textile Chemists and Colorists (AATCC) will host a joint session, Get Hands-On With E-Textiles Standards and Test Methods, Monday, November 12, 3:00-5:00 pm (ET), prior to the AATCC Fall Committee Meetings. During this session, IPC and AATCC will provide an overview of […]

IPC’s Job Task Analysis Needs Your Expertise to Address the Skills Gap

IPC president and CEO John Mitchell invites industry to join IPC’s Job Task Analysis Committee to help define key roles in the electronics industry and perform industry driven job task analysis for each of these roles.

IPC E-Textiles Committee Vice-Chair Launches “30 in 30” Free Video Series to Encourage Discussion on Key Topics in Smart Textiles

IPC D-70 E-Textiles Committee vice-chair Ben Cooper is running a new video series “30 in 30” through his IoClothes Forums. The forum discussions will showcase 30 videos in 30 days on topics that are critical to the continued growth of the smart textiles industry. A new video will be released every day for 30 consecutive […]

Automotive Electronics: Past/Present/Future

IPC president and CEO John Mitchell discusses technological advancements in automotive electronics and IPC’s standards development activities that support the automotive industry.

IPC is Seeking Participants for Technical Education Program Committee

IPC is seeking volunteers who represent all segments of the electronics manufacturing industry, for our Technical Education Program Committee, to help guide, create and develop high-quality educational programs through conferences, tutorials and workshops. This is a great opportunity to collaborate with your industry colleagues and to become more involved with IPC. For more information, contact […]

Don Dupriest Elected to Chair Top IPC Standards Leadership Committee

Don Dupriest, Lockheed Martin Missiles & Fire Control, has been elected chair of the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Dupriest succeeds Chris Mahanna of Robisan Laboratory, Inc., who held the role for IPC’s top standards development oversight committee for the past two years. As a Lockheed Martin Fellow on Lockheed […]

In Memoriam – Brian Butler

It is with deep sadness that IPC announces the death of one of its valued committee members and leaders, Brian Butler, president and CEO of Introbotix, Corp. Brian passed away on March 11, 2018. Brian joined the IPC D-21c High Speed/High Frequency Controlled Impedance Task Group in early 2000. He volunteered for numerous IPC task […]

IPC Publishes New Standard on Low Pressure Molding for Circuitry Encapsulation

IPC-7621 offers cost-effect alternative to potting IPC announces a new standard, IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics, a guidance document that offers instruction on using Low Pressure Molding (LPM) in place of potting for circuitry encapsulation. Unlike potting, where the […]