Category Archives: Assembly

IPC Assembly Quality Benchmark Survey Deadline Extended to June 16

The deadline for participation in IPC’s annual Quality Benchmark Survey for Electronics Assembly has been extended to Friday, June 16. This confidential survey is open to OEMs and contract manufacturers that do electronics assembly. Participants who complete the survey will receive a report on the findings at no cost. The survey is online at  www.ipc.org/2017BenchmarkSurvey […]

IPC Standards Committee Reports — Assembly and Joining, Product Assurance

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Assembly and Joining The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the […]

IPC Releases Annual Electronics Assembly Industry Quality

IPC’s Study of Quality Benchmarks for Electronics Assembly 2016 is now available. The annual study provides valuable benchmarking data to electronics assembly companies interested in comparing quality measurements to industry averages. The quality control measurements covered by the study include first-pass yields for various test methods in use as well as the percent of products […]

New Electronics Industry Market Data Now Available by Subscription

IPC is introducing three new quarterly subscription reports. These exclusive reports provide electronics manufacturers a competitive edge that comes from having solid, timely and reliable market research data. Reports include: Global Solder Market Report  – The report covers trends in solder and flux consumption, including growth rates, tin/lead vs. lead-free ratios, and industry growth outlook […]

IPC Standards Committee Reports – Assembly and Joining, Component Traceability, Flexible Circuits, High Speed/High Frequency

These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Assembly and Joining The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the […]

Preventing Production Defects and Product Failures

By Dr. Jennie S. Hwang, Ph.D., D.Sc. CEO & Principal, H-Technologies Group & Board Trustee & Distinguished Adj. Professor, Case Western Reserve University Under today’s manufacturing and market environment, the effort to maximize production yield, reduce cost and assure product reliability is becoming increasingly important to a company’s competitiveness. Considering the new and anticipated developments […]

IPC Standards Committee Reports – Component Traceability, Base Materials, Fabrication Processes, Assembly and Joining

These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Component Traceability The 2-19a Critical Components Traceability Task Group held its first face-to-face meeting to continue development of the working […]

IPC Releases Annual Electronics Industry Quality Benchmark Study

IPC Study of Quality Benchmarks for Electronics Assembly 2015 is now available. The annual study provides data to electronics assembly companies interested in comparing their quality measurements to those of other assembly companies by company size, region and type of product. The survey-based study addresses five major groups of manufacturing and service measurements: production, quality […]

IPC Standards Committee Reports — Base Materials, Fabrication, Assembly and Joining, Flexible Circuits

These standards committee reports from IPC APEX EXPO 2015 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully examined both Amendments 1 and 2 to the IPC-4101D, Specification for Base Materials for Rigid […]

Four IPC Global Statistical Programs Now Open

IPC’s global statistical programs for the laminate, solder, process consumables and assembly equipment industries are now open to new participants for 2015. The deadline for IPC members to sign up is April 15. Participation is free to IPC member companies as a benefit of membership. The statistical programs give participating IPC members access to global […]