Author Archives: Terry Costlow

IPC Sets Webinar on Mid-Term Elections

The outcome of the 2014 mid-term elections will likely have a significant impact on business conditions over the next few years. It is important to factor the results of Tuesday’s voting into your strategic planning especially since our industry is heavily effected by legislative and regulatory initiatives Next week, IPC will provide valuable insight on […]

IPC Working Group Focuses on Nuances of Conformal Coating

As products get smaller and denser, factors that used to be fairly easy to deal with can become areas of concern. Conformal coatings are getting increased interest now as usage grows and the quality of coatings comes under more scrutiny. These coatings have typically been applied and examined using a range of related standards. For […]

Teresa Rowe Aims to Help Committee Chairs Grow

Teresa Rowe has seen a lot of value in IPC’s programs over the past couple decades. They helped her advance in her career, and she’s helped write documents that provide the foundations for continued electronics industry growth. She learned a lot about technology while serving on 25 IPC committees, but that knowledge isn’t what she […]

Trade Show Pact Ensures “Building through Resilience”

IPC has bolstered its footprint in Asia, extending an alliance with the Hong Kong Printed Circuit Association (HKPCA). After successfully teaming up to run the International Printed Circuit & APEX South China Fair last year (IPC & HKPCA Show), the two agreed to co-host the event for four more years. The show will be held […]

Godspeed, Dieter Bergman

I first met Dieter Bergman in the early 1980s, in a small IPC office in Evanston. It had tons of boxes of booklets jammed in between huge copiers and desks so old they could have been updated by slapping an “I Like Ike” sticker on the grey metal. I had just moved to Illinois from […]

Nanotechnology Researchers Replace Solder with Water

Advanced research is often really interesting, and often not-so-much. For me, that’s especially true with nanotechnology. Some projects have potential to change things. Others seem like pipe dreams that will take decades to emerge, if they ever advance toward the mainstream. A new study on self-assembling electronics seems to fit in the middle. Researchers from […]

Nvidia Jumps on Package-on-Package Bandwagon

Package-on-package got another endorsement last week when Nvidia said it would use 3-D packaging on some forthcoming Pascal graphics processors to make more memory available with minimal delays. The move comes as more industries are adopting the company’s parallel processing chips. Nvidia President and CEO Jen-Hsun Huang made 3-D packaging one of the first highlighted […]

Satisfying the Hunger for Knowledge

When people decide which trade show they want to attend, they often face a choice that’s a bit like picking a restaurant. They can go to a buffet-like conference where there are many different presentations that don’t have a lot of depth, or go to a specialized show that offers truly good information in a […]

Joint Team Trims Standard Development Cycle

Getting multiple groups to work together often extends the time it takes to finish a project. But when IPC and JEDEC teamed up to create a standard for grid array package testing, they shortened the typical standard development cycle. IPC/JEDEC-9706, Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad […]

Volunteering: Just the Cure for Disassociated Workers

In the United States, approximately one in four people volunteers in one fashion or another. Anyone involved with IPC might be surprised by that statistic from the U.S. Bureau of Labor Statistics. The large number of IPC volunteers is just one factor that seems a bit at odds with the statistic. The other is the […]