Author Archives: Ray Pritchard

3D Packaging and Fan-Out Wafer-Level Packaging (FOWLP)

By: John H Lau, ASM, john.lau@asmpt.com Apple has been shipping their iPhone 7/7+ with their A10 application processor (AP) packaged by TSMC’s InFO (integrated fan-out) wafer-level packaging technology (or simply FOWLP) since September 2016. This is very significant, since Apple and TSMC are the “sheep leaders”. Once they used it, then many others will follow. […]

Dieter Bergman – Our Industry Loses an Icon

By Ray Pritchard IPC Executive Director Emeritus Dieter Bergman was the most accomplished, productive, creative and cheerful human being I ever met.  Besides, “he was always fun to be with.” That’s saying a lot because for more than 40 years I was involved in organizing and managing a number of trade associations, including 35 years […]