Author Archives: John H. Lau

3D IC Integration and 3D IC Packaging

3D IC integration will be a hot topic at IPC APEX EXPO

3D IC Packaging and 2.5D/3D IC Integration

PD30, Thursday, March 27, 2014, from 2:00 to 5:00 pm 2.5D/3D IC integration is taking the semiconductor industry by storm. It has been: (a) impacting chip suppliers, fab-less design houses, foundries, integrated device manufacturers, outsourced semiconductor assembly and test, substrates, electronic manufacturing service, original design manufacturers, original equipment manufacturers, material and equipment suppliers, universities, and research […]