Author Archives: IPC

PD18 : Preventing Production Defects and Product Failures

Under today’s manufacturing and market environment, the effort to maximize production yield, reduce cost, and assure product reliability is becoming increasingly important to a company’s competitiveness. Considering the new and anticipated developments in packaging and assembly and with the goal of achieving high yield and reliability in mind, the “how-to” prevent prevailing production defects and […]

Learn what Siemens PLM can do for you at IPC APEX EXPO

Don’t miss Siemens PLM Software at IPC APEX EXPO 2017 on Wednesday, February 15 at 10:00 AM and 4:00 PM, when our experts will be on hand to answer your questions related to our posters describing exciting new technologies and the strategies to implement them.  Look for the Siemens posters in public hallway areas of IPC APEX EXPO. Additive […]

IPC Study on North American PCB Industry Reports Growth in Military/Aerospace Market

Printed circuit boards (PCBs) for military and aerospace applications remain the largest vertical market segment for PCB manufacturers in North America, representing about one-third of the market. And it is the only vertical market segment expected to grow in 2016 as a share of the North American market, according to IPC’s 2016 Analysis and Forecast […]

IPC Standards Committee Reports — Base Materials, Assembly & Joining, Cleaning & Coating, Flex Circuits, High Speed/High Frequency

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the third in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully Balloted the Amendment 2 to the IPC-4101D-WAM1, Specification for Base Materials for Rigid and […]

IPC Standards Committee Reports — Assembly and Joining, Product Assurance

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Assembly and Joining The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the […]

IPC Standards Committee Reports – Printed Board Design, Testing, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports. Printed Board Design The 1-10b Printed Board Thermal Management Task Group met to discuss future testing programs for the evaluation of […]

In Memoriam — P. Douglas Lyle, Ph.D.

  Long-time IPC volunteer, P. Douglas (Doug) Lyle, Ph.D.,71, passed away on October 10, 2016. Doug was an active participant on the 3-10 Printed Board Base Materials Committee, 3-12d Woven Glass Reinforcement Task Group and 7-11b Base Materials Test Methods Task until his retirement from Advanced Glass Yarns (AGY). Doug will be missed by his […]

World PCB Production in 2015 Estimated at $58.6 Billion

The world market for printed circuit boards (PCBs) reached an estimated $58.6 billion in value in 2015 according to IPC’s  World PCB Production Report for the Year 2015.This represents a nominal decrease of 2.7 percent from 2014, but factoring out the effects of exchange rate fluctuations, the growth of PCB output was actually up 2.0 […]

How Might TPP & T-TIP Impact the Electronics Industry?

Trade Agreements’ Impact on the Electronics Industry, released by IPC, is a topic brief that explores the details of the Transatlantic Trade and Investment Partnership (T-TIP) and the TransPacific Partnership (TPP). In particular, the brief addresses the potential impacts of these trade agreements on the various segments and regions of the global electronics industry. Trade […]

IPC Essentials Preview

A new online course, “IPC Essentials,” designed to enhance knowledge of IPC Standards, the standards development process, and how to use standards, is coming soon to IPC EDGE.