Join the Weak Microvia Interface Open Forum During IPC APEX EXPO

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed in 2018 to identify the need to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface.

The subcommittee will hold an open forum during IPC APEX EXPO for industry to discuss this important topic and how industry can come together to address it. Attendees will be invited to share their own issues regarding the weak microvia interface and will learn how to participate on the subcommittee.

IPC Weak Microvia Interface Open Forum
Wednesday, January 30
10:15 AM to 12:00 PM
San Diego Convention Center
Room 11A

Agenda

10:15-10:20 AM – Introduction and Organization / IPC Solutions Committee Logistics
Chris Jorgensen, IPC staff

10:20-10:30 AM – Background: History of the effort, scope of work, status and organization
Marc Carter, V-TSL-MVIA Chair

10:30-10:45 AM – Presentation: Current Understanding of the Problem/Mitigation Measures
Jerry Magera and J.R. Strickland, Motorola

10:45-11:05 AM – Weak Microvia Interface Project Subteam Reports
• Data Collation and Mining on the Issue
Happy Holden
Using results of tests already conducted by various organizations to establish “knowns” vs. “unknowns” for further study and/or confirmation

• FMEA “Fishbone”

Presentation on what the group has done so far, the categories and that we need volunteer experts to help fill in that information

• Engineering Simulation
Marc Carter

Initial high-level model debugging
Incorporating data collation and Fishbone targets going forward

11:05-11:30 AM – Next Steps and Goals
• Near term:
o Breakout teams (plan for Thursday working meeting based on Fishbone)
Marc Carter
o Published literature and public data “mining” effort
Mike Carano, V-TSL Committee Chair
• Middle term:
o Knowns/Unknowns: Can any intermediate conclusions or improved mitigation techniques be communicated in another white paper?
o Identify Testing Needed: Gaps and confirmation
o Capture suggestions from the floor (continue during Q&A/Discussion)
• Long term: Prevention: Can it be accomplished through design, process enhancements, etc.?

11:30AM-12:00PM – Q&A Session and How to Get Involved

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed as a result of work done on IPC-WP-023. Order IPC-WP-023, IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance Via Chain Continuity Reflow Test: The Hidden Reliability Threat – Weak Microvia Interface from the IPC bookstore.

For more information on the IPC V-TSL-MVIA Subcommittee, e-mail me at ChrisJorgensen@ipc.org.

2 Comments

  1. Roxanne Jones
    Posted January 24, 2019 at 12:29 pm | Permalink

    I do plan on attending but was hoping to read IPC-wp-023 prior to Wednesday. Is it available to IPC members or is this another purchase requirement?


Post a Comment

Required fields are marked *

*
*

%d bloggers like this: