IPC Subcommittee to Host Open Forum on Weak Microvia Interface During IPC APEX EXPO

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee, formed this year, is working to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface. The activity grew out of the development of IPC-WP-023, a white paper that cast a light on how a weak microvia interface is a hidden reliability threat.

The subcommittee will hold an open forum for industry to learn about its activities as well as its planned path forward. Attendees will be invited to share their own issues regarding weak microvia interfaces and will learn how to participate on the subcommittee.

IPC Weak Microvia Interface Open Forum
Wednesday, January 30, 2019
10:15 AM to 12:00 PM
San Diego Convention Center
Room 6

Order IPC WP-023, IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance Via Chain Continuity Reflow Test: The Hidden Reliability Threat – Weak Microvia Interface from the IPC bookstore.

For more information on the IPC V-TSL-MVIA Subcommittee, contact me at ChrisJorgensen@ipc.org.

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