IPC Releases Annual Electronics Assembly Industry Quality

IPC’s Study of Quality Benchmarks for Electronics Assembly 2016 is now available. The annual study provides valuable benchmarking data to electronics assembly companies interested in comparing quality measurements to industry averages.

The quality control measurements covered by the study include first-pass yields for various test methods in use as well as the percent of products subjected to these tests. Yields and defect rates at final inspection, internal yields of key processes, and DPMO and yield targets are also covered. Average cost of poor quality as a percentage of sales for rework, scrap and labor time for touch-up after wave soldering are reported. The study also reports on the use of various quality control methods.

Customer satisfaction and supplier performance metrics are covered in the study, as well as the industry’s adoption of major quality certifications.

The data — in averages, medians and percentiles — are segmented by company size tier, by region, and by type of production including rigid PCBs, flexible circuits, end products, mechanical assembly, cable and harness, discrete wiring terminal and connectors, and rigid back planes.

The aggregate data represent 94 electronics assembly companies of all sizes from North America, Europe and Asia.

The 150-page report is free to companies that participated in the survey. It is available for sale to IPC members for $675 and to nonmembers for $1,350. For more information or to purchase the report, visit www.ipc.org/AssemblyBenchmark2016 or contact IPC’s market research department at marketresearch@ipc.org.

For information on all of IPC’s market research programs, visit www.ipc.org/IndustryData.

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