IPC Standards Committee Reports
These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the first in the series of reports
Printed Board Design
The 1-10c Test Coupon and Artwork Generation Task Group met to review the newly developed Users Guide for the IPC-2221B Gerber Coupon Generator that will be released for use by the industry in late 2015. The Generator allows for the creation of Gerber files for test coupon designs found in Appendix A of IPC-2221B, Generic Standard on Printed Board Design. The group also reviewed a demo for a modification to the Gerber Coupon Generator for a propagated “D” coupon.
Cleaning and Coating
The 5-31g Stencil Cleaning Task Group met to work on IPC-7526, Stencil and Misprinted Board Cleaning Handbook. Sections 1 and 2 were revised. Material compatibility, snapback, dry vs wet wipe, nano-coating stencils, and small openings were among the subjects discussed.
The 5-31j Cleaning Compatibility Task Group met to discuss how to begin verification testing. They want to create acceptability levels for OEM and CM companies. Confirmation testing and test materials were discussed. Comments on document to be reviewed after the end of the year
The 5-32a Ionic Conductivity Task Group discussed the status of several ongoing projects involving Ion Chromatography. This includes: method detection limit round robin testing, IC Webinar for the SMART group from Doug Pauls, Rockwell Collins, updating WP-008, extract correlation study, localized extraction, and the J-STD-001 ROSE effort.
The 5-32b SIR and Electrochemical Migration Task Group met to discuss the statuses of several ongoing projects regarding SIR testing including: Round Robin study for hard wire vs test rack testing, discussion of several test methods, High Voltage SIR testing, and review of IPC-9203, B-52 Test Coupon User’s Guide.
The 5-32c Bare Board Cleanliness Assessment Task Group met to finalize the decisions made regarding five Test methods. A study was initiated to support the update of IPC-5704, Cleanliness Requirements for Unpopulated Boards in hopes of adding it as a requirement in IPC-6012, Performance of Rigid Printed Boards.
The 5-32e Conductive Anodic Filament (CAF) Task Group continued the revision of IPC-9691, User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
The 5-33a Conformal Coating Task Group met to work on Revision C of IPC-CC-830, Qualification and Performance of Electrical Insulating Compounds for Printed Wiring Assemblies. DWV/MIR white paper was presented and decisions were made regarding what to include in CC-830C. The new Test Coupon, B-54, was presented. 5-33AWG also met to work on the CC-830 Handbook. Plexus presented pictures for use by the committee and Electrolube UK showed presentation on coating performance.
The 5-33g Low Pressure Molding Task Group continues to address the Draft of IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics.
The 7-11 Test Methods Subcommittee to review a proposal by Gerard O’Brien, StandS Group, for using XRF to determine phosphorous content in ENIG. There was a discussion of a Validation Process and Method Review for IPC methods. They proposed that the TAEC review all released Test Methods, new and revised. Also proposed that IPC could potentially provide validation for Test Method operators and auditing to ensure proper testing.
The 7-12 Microsection Subcommittee met to continue the revision of IPC-9241, Microsectioning Guideline (formerly MS-810) and review the comments on KAVI. Feedback from the recently released TM 2.1.1F, Microsectioning, Manual Method and a proposed Microsectioning Training course were also discussed.
The D-32 Thermal Stress Test Methods Subcommittee met to discuss the next steps moving forward on the revision of TM 220.127.116.11, Thermal Shock and 2.6.27, Thermal Stress. A PIN is to be drafted and discussed at the next teleconference.
The 7-23 Assembly Process Effects Handbook Subcommittee met to discuss the format and content of the new IPC-9111, Troubleshooting for Printed Board Assembly Processes, before going to Final Industry Review.
The 7-30 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the meetings to be held in APEX 2016.
The 7-31b IPC-A-610 Task Group reviewed comments on IPC-A-610, Acceptability for Electronic Assemblies. The Task Group met a second day to resolve comments on criteria comment to both IPC-A-610, Acceptability for Electronic Assemblies, and IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. The group also celebrated completion of the forthcoming IPC-A-610 Revision F Amendment 1.
The 7-31bc Telecom Addendum Task Group met to continue discussions on the revision of the document. The Task Group plans to update the addendum using Revision F of IPC-A-610, Acceptability for Electronic Assemblies as the base document.
The 7-31f Task Group responsible for IPC-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies, met to continue revision work on the document.
The 7-31j Task Group met to continue revising IPC-A-630, Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures. The Task Group also discussed and approved a new title for the standard that will be introduced with the revision.
The 7-31k Wire Harness Design Task Group and 7-31h IPC-HDBK-620 Handbook Task Group met to celebrate the forthcoming IPC-D-620, Design and Critical Process Requirements for Cable and Wiring Harnesses, and to open discussion on IPC-HDBK-620, Handbook and Guide to Supplement IPC-A-620.
The 7-31m Fiber Optic Cable Acceptability Task Group agreed to split the working draft IPC-A-640 into separate standards for design (IPC-D-640) and acceptance (IPC-A-640). Because most of the content for the design document is already on hand, the group will focus first on IPC-D-640, with plans to ballot by APEX/EXPO, and will pick up work on IPC-A-640 near that time, with a goal to publish later in 2016.
The 7-32c Electrical Continuity Task Group met to review industry responses to a survey on adjacency testing for bare printed board electrical test. Additional input on the need to specify a minimum retention period for electrical test data and clarification on when electrical testing for Class 3 product can be agreed upon between user and supplier drove the group to determine that a “B” revision to the IPC-9252, Requirements for Electrical Testing of Unpopulated Printed Boards, should be developed for a 2016 release.
The 7-34 Repairability Subcommittee met to continue revising IPC-7711/21, Rework, Modification and Repair of Electronic Assemblies.