Industry Submits More than a Dozen Exemption Requests for RoHS Exemptions Set to Expire

IPC, in conjunction with an international industry stakeholder group, applied for more than a dozen exemption extension requests under the European Union (EU) RoHS Directive. The RoHS2 Directive dictates expiration dates for all exemptions granted and several critical to the electronics manufacturing industry are set to expire in 2016. Throughout the process, IPC and several member companies provided important technical information in order to ensure the extension requests are robust and scientifically sound. IPC reviewed all extension requests and provided important feedback that resulted in credible material submitted to the EU Commission.

Extension requests were submitted for the following exemptions:

  • 4(f)         Mercury in other discharge lamps for special purposes not specially mentioned in this Annex
  • 6(a)        Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight
  • 6(b)        Lead as an alloying element in aluminum containing up to 0.4% lead by weight
  • 6(c)         Copper alloy containing up to 4% lead by weight
  • 7(a)         Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead)
  • 7(c)-I      Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix  compound
  • 7(c)-II    Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher
  • 7(c)-IV   Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors
  • 8(b)        Cadmium and its compounds in electrical contacts
  • 13a          Lead in white glasses used for optical applications
  • 13b         Cadmium and lead in filter glasses and glasses used for reflectance standards
  • 15           Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
  • 34           Lead in cermet-based trimmer potentiometer elements
  • 37           Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body

The final applications can be viewed here (by IPC members only).

IPC will continue to monitor and be involved in the exemptions process. If you have any questions, or are interested in joining IPC’s efforts, please contact Fern Abrams, IPC director of regulatory affairs and government relations, at FernAbrams@ipc.org or +1 202-661-8092.

 

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