IPC Standards Committee Reports – Terms and Definitions, High Speed/High Frequency, Rigid Printed Boards, Embedded Devices, Printed Electronics

These standards committee reports from the 2014 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the third report in the series.

Terms and Definitions

The 2-30 Terms and Definitions Committee met to resolve comments to the Final Draft of IPC-T-50M, Terms and Definitions for Interconnecting and Packaging Electronic Circuitry.  The forthcoming revision will address new and revised terms for conformal coatings, potting and encapsulating materials, stencil design, statistical process control, and bottom termination component (BTC) devices.

High Speed/High Frequency

The D-21 High Speed/High Frequency Design Subcommittee has been reactivated to develop a new IPC-2228, Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards.  The effort addresses a gap in the series of IPC-222X printed board design standards, as currently there are only IPC guidelines dedicated to RF/Microwave circuitry (IPC-2251 and IPC-2252).  This document will establish requirements for the design of printed boards as they apply to radio waves in the frequency range of 100 MHz to 100 GHz utilizing waveguides or antennas.  A working draft will be made available for review in in Q1 2015.

The D-22 High Speed/High Frequency Performance Subcommittee continued with updates to the the working draft of IPC-6018C, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards.  Thermal stress testing requirements for high frequency boards with microvias was the primary topic.  The group also reviewed a proposal from Intel Corp. on the need for a standardized measurement methodology for the surface roughness of treated copper foil “in process” by a printed board fabricator prior to lamination to other subcomposite printed board layers.  A new IPC D-22a task group will be established to address this need.

The D-23 High Speed/High Frequency Base Materials Subcommittee having released the Amendment 1 to IPC-4103A, Specification for Base Materials for High Speed/High Frequency Applications found some additional changes that need correction and worked on five sections as a start on Amendment 2.

Rigid Printed Boards

The D-31b IPC-2221/2222 Task Group, responsible for the IPC-2221B, Generic Standard on Printed Board Design, met to discuss the need for a revision to the IPC-2226, Sectional Design Standard for HDI Printed Boards, which has not been updated since its original 2003 publication date.  It was agreed that the revision effort will be handled by this task group.  Members of WKK Distribution Ltd. and ESI offered to lead a sub-group that would work from October 2014 – February 2015 on a first working draft of IPC-2226A that would be provided for in-depth review at IPC APEX EXPO 2015.

The D-33a Rigid Printed Board Performance Task Group reviewed comments on the final draft of IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards.  The group focused on comments related to requirements for periodic (monthly or quarterly) quality conformance testing and marking legibility requirements for etched or ink marking.  The task group then began developing a list of conforming and non-conforming imagery for new sections of IPC-6012D that will be incorporated into an IPC-A-600J, Acceptability of Printed Boards.

The D-35 Printed Board Storage and Handling Subcommittee addressed the working draft to IPC-1601A, Printed Board Handling and Storage Guidelines. The subcommittee plans to develop an Appendix that provides samples of industry packaging requirements for board fabricators across three categories of packaging complexity.  The group also addressed a gap in the document where the impact of baking of printed boards affects the solderability of ENIG applied surface finishes.

Embedded Devices

The D-55 Embedded Devices Process Implementation Subcommittee discussed comments received during the recent balloting of IPC-7092, Design and Assembly Process Implementation for Embedded Components Document passed the ballot process, but some reservations associated with one negative ballot were reviewed and dispositions provided. A final resolution acceptance meeting is required by procedure, which will either result in a unanimous acceptance or publication with one dissenting vote before January 1, 2015.

 Printed Electronics

The D-60 Printed Electronics Committee welcomed new additions to the leadership of this active general committee overseeing printed electronics standards development as Raj Kumar agreed to take the chair position, freeing Dan Gamota to step back to a vice-chair position.

The D-61 Printed Electronics Design Subcommittee continued to gather input for revision A of IPC-2291, Design Guidelines for Printed Electronics. The group has set a preliminary release date of fall 2015. Dr. Hirofumi Matsumoto has been added to the D61 leadership group as cice-chair to facilitate design needs exchange with the JPCA “mirror” committee.

The D-62 Printed Electronics Base Materials Substrates Subcommittee is preparing significant expansions in scope to IPC/JPCA-4921 including new information on glass and glass-like substrates, many additional plastic film alternatives, and an entirely new cellulosics section. Target for publication of revision A: 1Q 2015.

The D-63 Printed Electronics Functional Materials Subcommittee continued to gather material for IPC/JPCA 4591A, expanded the scope to include information on insulatives, optically-active, and possible semi-conductive functional materials. The expanded scope may delay the proposed 1Q 2015 publication date until 3Q 2015.

The D-64 Printed Electronics Final Assembly Subcommittee prepared a working draft of IPC-6901, Performance Requirements for Printed Electronics Assemblies for review. An additional co-chair is needed, but a vice chair has been added to help reduce the load on the existing chair, whose work duties force a pullback from IPC activities.

The D-65 Printed Electronics Test Method Development and Validation Subcommittee has begun independent activities with a number of new committee participants. The first draft of one test method subsection (flexibility evaluations) has been received and is under committee review. Murad Kurwa, Flextronics, is the new co-chair sharing the workload with Dan Gamota, Jabil Circuit.

The D-66 Printed Electronics Processes Subcommittee continues to work closely with the JPCA “mirror committee” to refine “best practices/implementation guideline” draft for printed electronics processing. Preliminary goal for initial release: fall 2015.

 

 

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