IPC Standards Committee Reports — Base Materials, Fabrication, Assembly & Joining, Flex Circuits

These standards committee reports from the 2014 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports.

Base Materials

The 3-11 Laminate/Prepreg Materials Subcommittee successfully revised, balloted and released IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards in April 2014. Shortly after this, a few company members brought up some details in the released version that they believe requires an Amendment modification to the D revision. This took up more than 75 percent of the meeting to discuss and decide the items to be covered in an amendment to IPC-4101D. The other 20-25 percent of the meeting involved distributing hard copies of IPC-4101D to the 3-11 Subcommittee members listed in the document’s Acknowledgement Page.

The 3-11f UL/CSA Task Group discussed upcoming items for ballot by the STP members in the UL 796 standard for rigid or multilayer printed boards. The group went through nearly two dozen items for comment in UL 746E Ballot by the STP group on these items in this UL standard will begin shortly.

The 3-11g Corrosion of Metal Finishes Task Group reviewed the status of mixed flowing gas testing of various metal finishes for corrosion on component leads as well as printed board surfaces. Flowers of Sulfur (FoS) corrosion testing was also reviewed during the meeting.

The 3-12a Metallic Foil Task Group addressed some round-robin data results using the non-contact surface roughness test (proposed TM 2.2.22). While data is only available from three of six test facilities, data is trending to show reasonable surface roughness information.

The 3-12d Woven Glass Reinforcement Task Group examined weave size data for four weave styles (106, 1080, 2116 and 7629) measured in a round robin test format by four test facilities. Statistical analysis (Gauge R & R) of the test data was not as consistent as hoped, but was showing adequate viability of the test procedure used by the four test companies. More testing is needed.

Fabrication Processes

The 4-14 Plating Processes Subcommittee reviewed revision A efforts underway on IPC-4552, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards. The group is using the released copy of IPC-4556, Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards as a template. Some of the items to be included in the revision A were discussed: a) Work on a test vehicle to evaluate a thinner gold plate for performance, b) Other work on evaluating hypercorrosion of the electroless nickel when the immersion gold is deposited, c) A test method being developed to measure the phosphorus content in the nickel is nearly completed, and d) In order to analyze the phos content of the underlying nickel, two test methods to strip the gold overplate are in development.

Assembly and Joining

The 5-11c Electronic Assembly Adhesives Task Group is approaching final draft status for a new document, IPC-HDBK-4691, Guidelines for Design, Selection, Application, and Reliability of Adhesives and Associated Processes Used for Electronics Assembly Purposes (working title). Publication target: 1 Q 2015.

The 5-21g Flip Chip Mounting Task Group is preparing revision A of IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components. The committee confirmed 7094 will not contain new packaging concepts of 2.5 and 3-D package configurations (addressed separately in a, IPC-7091 byB-11 Subcommittee). To facilitate that separate approach, a limited-scope (fast-track) revision of 7094A is planned, primarily for the addition of ultra-fine-line, copper pillar, and bump-on-trace (BOT) technologies, to free up some of the shared resources for the larger, more complex IPC- 7091 effort. Target publication of 7094A is expected by 2016 IPC APEX Expo.

The 5-21k IPC-SM-817 SMT Adhesive Task Group completed follow-up on comments received on the Final Industry Review circulation of IPC-SM-817A, General Requirements for Dielectric Surface Mounting Adhesives. The document will now be balloted.

The 5-22a J-STD-001 Task Group celebrated the release of IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies. The committee also discussed industry feedback on some of the changes and voted to open the document for an amendment. The committee leadership is considering teleconferencing as a means for moving ahead quickly with discussions on these concerns.

The 5-22arr J-STD-001/Conformal Coating Material & Application Industry Assessment Task Group discussed the current status of round robin testing.

The 5-22as Space Electronic Assemblies Task Group completed review of the comments to the new revision F. The document will be prepared for Final Industry Review.

The 5-22F IPC-HDBK-001 Task Group continued work on the revisions to the document to incorporate J-STD-001 Revision F changes. The task group set an aggressive timeline and is working to complete actions and discussion before the end of 2014 using KAVI and teleconferencing opportunities.

The 5-22bt J-STD-001 Technical Training Committee met with the provider for the updates to the J-STD-001 training program and to discuss the use of Certification Quality Initiative (CQI) for testing and reporting. The beta class for the new course materials is being scheduled for December 2014.

The 5-22ad Requirements for Military Systems Working Group reviewed soldering on military systems and identified where more stringent requirements than those currently in J-STD-001 may be necessary.

The 5-23b Component and Wire Solderability Specification Task Group continued working on the next revision of J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires.

The 5-24b Solder Paste Task Group is reviewing test methods originating with the group.

Flexible Circuits

The D-13 Flexible Circuits Base Materials Subcommittee has started a 30-day ballot on revision A of IPC-FC-234, Pressure Sensitive Adhesive (PSA) Assembly Guideline for Rigid, Flexible or Rigid-Flex Printed Boards. The subcommittee is also in the ballot process for an Amendment 1 to IPC-4203A, Cover and Bonding Material for Flexible Printed Circuitry that will add another specification sheet material (/25 for a polyamide-imide copolymer) to the document.

The D-15 Flexible Circuits Test Methods Subcommittee addressed revising TM 2.6.3.2 Insulation and Moisture Resistance Flexible Base Dielectric Board to its C revision,that will have a new title: Surface Insulationand Moisture resistance, Copper Clad Flexible Dielectric Material. The work that took place significantly improved the test method’s clarity.

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