IPC Standards Committee Reports — Printed Board Design, Cleaning & Coating, Testing, Process Control, Product Assurance

These standards committee reports from the 2014 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports.

 Printed Board Design

The 1-10b Current Carrying Capacity Task Group met to discuss a roadmap for a revision of the existing IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design.  The revision effort is intended to address high current (transient) pulses, flexible printed boards, and microvias.

The 1-10c Test Coupon and Artwork Generation Task Group provided an update on the forthcoming IPC Test Coupon Gerber Generator that is being developed to allow OEMs and fabricators to create Gerber files for AB/R test coupons described in Appendix A of IPC-2221B, Generic Standard on Printed Board Design. The Coupon Generator is expected to be available for industry use in Q1 2015.

 

Cleaning and Coating

The 5-32c Bare Board Cleanliness Assessment Task Group is evaluating a proposed rewrite to the 3.8 cleanliness section within IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards. The rewrite addresses advances in cleanliness testing by way of ion chromatography (IC) and related testing within IPC-5704, Cleanliness Requirements for Unpopulated Printed Boards. Members of the 5-32c task group are working with members of the D-33a Rigid Printed Board Performance Task Group to edit the proposal and submit as a future Amendment 1 to the D Revision of IPC-6012, which is expected to be completed by Q1 2015.

The 5-32e Conductive Anodic Filament (CAF) Task Group discussed revising the IPC-9691A, User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) to its B revision. There is need to split the user’s guide into two major modes; true CAF failures and internal electrochemical migration which is caused by hollow glass fibers, poor resin wetting of the reinforcements, roughly drilled holes and excessive copper wicking. Revision B of IPC-9691 will progress at a slower rate than earlier anticipated, as this information is gathered.

 

Testing

The 7-11 Test Methods Subcommittee established a list of “domain experts” within the subcommittee that would be available to assist relevant task groups who are either creating or revising IPC-TM-650 test methods when they are tasked with building a Gage R&R Validation Plan for their method, which is a requirement of the IPC-MDP-650, Method Development Packet. These domain experts would assist a test method group in identifying what would need to be reported in a Validation Plan for their specific method creation or revision.

The 7-12 Microsection Subcommittee established a Gage R&R Validation Plan for the new IPC-TM-650, Method 2.1.1F, Microsectioning, Manual and Semi or Automatic Method. The revision is a combination of previous versions of IPC-TM-650 Methods 2.1.1 and 2.1.1.2.  Method 2.1.1.2 will be cancelled following the release of Method 2.1.1F.  The subcommittee also discussed plans for a new IPC-TM-650 Method 2.1.1.3 that will address microsection evaluations of blind and buried microvia structures, included stacked and staggered configurations.

 

Process Control

The 7-23 Assembly Process Effects Handbook Subcommittee addressed problems, probable cause, and actions taken in troubleshooting assembly processes in the developing IPC-9111, Troubleshooting for Printed Board Assembly Processes. A working draft of the document is close to being completed for review by the committee.

The 7-24 Printed Board Process Effects Handbook Subcommittee is pushing completion of IPC-9121, Printed Board Process Effects, a companion document, to IPC-9111, Printed Board Assembly Process Effects. This document will serve as a new process effects analysis/troubleshooting guide and also as syllabus for an advanced troubleshooting PD class under development. The handbook will provide printed board anomaly illustrations with possible cause and solution explanations and will be more closely tied to IPC-A-600 acceptability criteria.

 

Product Assurance

The 7-31b IPC-A-610 Task Group celebrated the release of Revision F of IPC-A-610, Acceptability for Electronic Assemblies. The committee also discussed industry feedback on some of the changes and voted to open the document for an amendment. The committee leadership is considering teleconferencing as a means for moving ahead quickly with discussions on these concerns.

The 7-31bt IPC-A-610 Technical Training Task Group met with a training provider to discuss updates to the IPC-A-610 training program and to discuss the use of Certification Quality Initiative (CQI) for testing and reporting. The beta class for the new course materials is being scheduled for February 2015.

The 7-31f IPC/WHMA-A-620 Task Group began revision work on IPC/WHMA-A-620. The task group is on an aggressive schedule to resolve comments and add new content as it becomes available. The committee is using KAVI to communicate and share documents.

The 7-31k Wire Harness Design Task Group and the 7-31h IPC-HDBK-620 Handbook Task Group combined their efforts to continue working on IPC-D-620, Design and Critical Process Requirements for Cable and Wiring Harnesses. The group is nearing completion of its draft and is moving toward a final industry review in the coming months.

The 7-31m Fiber Optic Cable Acceptability Group is creating a standard (IPC-A-640) to provide information on the general design and acceptance requirements for optical fiber, optical cable and hybrid wiring harness, and installation. This standard will be a collection of visual, mechanical, and performance quality acceptability requirements for fiber optic cable assemblies. A working draft document is being developed.

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