Trade Show Pact Ensures “Building through Resilience”

IPC has bolstered its footprint in Asia, extending an alliance with the Hong Kong Printed Circuit Association (HKPCA). After successfully teaming up to run the International Printed Circuit & APEX South China Fair last year (IPC & HKPCA Show), the two agreed to co-host the event for four more years.

The show will be held in Shenzhen, China, December 3–5, 2014. Last year, IPC and HKPCA partnered to make the exhibition an enormous success.

“The cooperative effort in Hong Kong is now the largest trade show in the world in the PCB industry,” said Philip Carmichael, president of IPC Greater China.

Last year, the show hosted 499 exhibiting companies, 2,000 booths and occupied 300,000 square feet of space. This event attracted 41,831 attendees.

The two associations are being helped by the China Council for the Promotion of International Trade Guangzhou Sub-council. IPC is also producing a number of smaller trade shows and conferences in Asia, providing training, education and industry standards expertise to help companies and individual attendees.

Carmichael noted that the 2014 theme, “Building through Resilience,” conveys what our industry is seeing in China. “Steady growth, new technology and the resilience to take on new challenges in the competitive global printed board industry are all part of China’s business environment,” he added.

Post a Comment

Required fields are marked *

*
*

%d bloggers like this: