These standards committee reports from IPC APEX EXPO 2014 have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports.
Data Generation and Transfer
The 2-16 Product Data Description (Laminar View) Subcommittee discussed potential new requirements and possible changes to IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology. The group also discussed ways to develop user guides that show designers how to implement 2581 concepts in their transfer between design and manufacturing.
The 2-18 Supplier Declaration Subcommittee discussed the need to revise IPC-1751A, General Requirements for Declaration Process Management. The revision will facilitate the harmonization of all IPC data exchange standards and with the IEC 62474 materials declaration standard. As part of the revision, the subcommittee will restructure the 175x family of standards. The restructuring will allow the laboratory declaration standard (IPC-1753) and conflict minerals standard (IPC-1755) to be part of the IPC-175x family of standards.
The 2-18b Materials Declaration Task Group discussed further enhancements to IPC-1752A Materials Declaration Management. The task group continues to work in concert with the IEC 62474 materials declaration standards group to ensure harmonization of the standards. The task group also discussed the process for requiring solution providers to undergo a yearly review to ensure they follow the latest released standard, schema and IPC lists of substance categories and exemptions.
The 2-18f Packing Materials Declaration Task Group discussed amending IPC-1758, Declaration Requirements for Shipping, Pack and Packing Materials, to includEe a field for declaring recycled content of packaging material. The task group will propose an amendment after IPC-1751A, General Requirements for Declaration Process Management is revised.
The 2-18j Laboratory Declaration Task Group celebrated the approval of IPC-1753, Laboratory Report Declaration Standard. The standard allows for laboratory data to be seamlessly exchanged among supply chain partners.
Electronic Documentation Technology
The 2-40 Electronic Documentation Technology Committee and 2-41 Product Data Description Subcommittee discussed the IPC-261X series. Discussion included modifications to IPC-2611, Generic Requirements for Electronic Product Documentation, IPC-2612, Sectional Requirements for Electronic Diagramming Documentation and IPC-2612-1, Sectional Requirements for Electronic Diagramming Symbol Generation Methodology, as well as IPC-2614, Sectional Requirements for Board Fabrication Documentation. The committee started work on IPC-2614-1 which shows how to use an XML computer format to describe laminate materials.
Environment, Health and Safety
The 4-30 Environmental, Health and Safety Committee heard presentations and discussed several EHS issues impacting the electronics industry. The committee will help write the EHS section of the 2015-2016 IPC Roadmap. A presentation on the EICC Code of Conduct sparked good debate and discussion on what requirements may be seen in the future. IPC staff gave an update on their advocacy efforts on substance restrictions, both nationally and internationally. The presentations are available to IPC Members only at http://www.ipc.org/ehs.
The 4-32 Equipment Safety Subcommittee discussed the continued efforts to develop a joint equipment safety standard with SEMI. Committee members present at the meeting discussed the need to move forward with a draft standard.
The 4-34b Marking, Symbols and Labels for Identification of Assemblies, Components & Devices Task Group reviewed updates needed on J-STD-609A, IPC/JEDEC Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes, including adding references to the recast RoHS Directive and clarification that markings under this standard do not denote EU RoHS compliance or any other regional substance restriction legislation addressing lead content. The standard was intended to label PCB surface finishes, component terminal finishes and attachment solders not the lead used internal to the component.
Read additional IPC Standards Committee Reports:
- IPC Standards Committee Reports: Assembly/Joining, Process Control, Flex Circuits, Rigid Printed Boards
- IPC Standards Committee Reports: Base Materials, Fabrication, High Speed/High Frequency, Embedded Devices
- IPC Standards Committee Reports: Printed Board Design, Cleaning & Coating, Testing, Product Assurance