These standards committee reports from IPC APEX EXPO 2014 have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports.
Printed Board Design
The 1-10c Test Coupon and Artwork Generation Task Group provided an initial view of the IPC Test Coupon Gerber Generator that is being developed to allow OEMs and fabricators to create Gerber files for AB/R test coupons described in Appendix A of IPC-2221B, Generic Standard on Printed Board Design. The Coupon Generator is expected to be available for industry use by the end of 2014.
Cleaning and Coating
The 5-32c Bare Board Cleanliness Assessment Task Group initiated review on a proposed rewrite to the 3.8 cleanliness section within IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards. The rewrite, drafted by Don Dupriest of Lockheed Martin Missiles and Fire Control, addresses advances in cleanliness testing by way of ion chromatography (IC) and related testing within IPC-5704, Cleanliness Requirements for Unpopulated Printed Boards. Members of the 5-32c task group will work with members of the D-33a Rigid Printed Board Performance Task Group to edit the proposal and submit as a future Amendment 1 to the D Revision of IPC-6012, which is expected to be completed by the end of 2014.
The 5-32e Conductive Anodic Filament (CAF) Task Group discussed revisions to IPC-9691, User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing). The task group made final corrections to the proposed B revision and a final draft will be sent out for comments.
The 5-33a Conformal Coating Task Group reviewed IPC-CC-830, Qualification and Performance of Electrical Insulating Compounds for Printed Wiring Assemblies. This group is pursuing a C revision rather than an amendment. The revision will include a test method for adhesion and address issues with testing and documentation on insulation testing results of 500 megohms vs. 5000 megohms. The task groupformed working group 5-33AUT to discuss and develop criteria for “ultra-thin” coatings.
The 7-12 Microsection Subcommittee completed revisions to IPC-TM-650, Method 2.1.1F, Microsectioning, Manual and Semi or Automatic Method. The revision is a combination of previous versions of IPC-TM-650 Methods 2.1.1 and 184.108.40.206. Method 220.127.116.11 will be cancelled following the release of Method 2.1.1F. The subcommittee will meet again to begin developing a validation plan for Gage R&R testing of the method revision.
The 7-31b IPC-A-610 Task Group continued work on Revision F of IPC-A-610, Acceptability for Electronic Assemblies. The task addressed more than 50 comments and action items and met with the J-STD-001 Task Group to resolve an additional 40 comments and action items common to both standards. IPC staff is now preparing IPC-A-610 Revision F for ballot.
The 7-31bt IPC-A-610 Technical Training Task Group also met to discuss ideas for the Revision F training program update.
The 7-31j Requirements for Structural Enclosure Task Group published IPC-A-630, Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures in September 2013. IPC-HDBK-630 has been completed and is currently being typeset. The document should be released for publication by the end of May. The next step is to develop the training course for IPC-A-630. The goal is to have the training into beta testing by the end of 2014.
The 7-32c Electrical Continuity Testing Task Group developed a questionnaire intended to obtain feedback from printed board fabricators, solder mask suppliers, and electrical test software vendors on a proposal to revise IPC-9252A, Requirements for Electrical Testing of Unpopulated Printed Boards, with respect to z-axis adjacency testing.
Read additional IPC Standards Committee Reports:
- IPC Standards Committee Reports: Data Transfer, Supplier Declaration, Electronic Documentation, EH&S
- IPC Standards Committee Reports: Assembly/Joining, Process Control, Flex Circuits, Rigid Printed Boards
- IPC Standards Committee Reports: Base Materials, Fabrication, High Speed/High Frequency, Embedded Devices