Do You Know which Stencil Works Best?

Photo Stencil  Staff Present “Print Performance Studies Comparing Electroform and Laser-cut Stencils” at IPC APEX EXPO  

S04-Printing I, March 25 from 1:30-3:30 PM

blogPhoto Stencil, LLC staff  will present, “Print Performance Studies Comparing Electroform and Laser-cut Stencils,” at IPC APEX EXPO on Tuesday, March 25th from 1:30–3:30 pm at Technical Session S04-Printing I. Presented by Rachel Miller-Short and written in collaboration with William E. Coleman Ph.D., of Photo Stencil and Joseph Perault of Parmi, the presentation fully evaluates various stencil types available in the industry today to determine which provide the best paste release results for small apertures while providing enough solder paste volume for normal-sized SMT components. The study includes a comparison of laser-cut electroformed blank foils as an alternative to normal electroformed stencils, and, in addition to electroformed stencil variations, evaluated various coatings and post processed stencils.

“As components get smaller, it is difficult to print solder paste to satisfy the requirements of both very small components, such as .4 and .3mm pitch CSPs, as well as normal SMT components,” explained Rachel Short, VP sales and marketing, Photo Stencil. “The large components require more solder paste volume for sufficient solder fillets after reflow; however, if the stencil normally used to print solder paste for SMT components is used for the small components, the apertures are so small that poor paste release may be encountered. The area ratio plays a large part in this dilemma. Our study details the performance of 12 stencils in 5 different categories.”

In addition, Dr. Coleman will present the poster “Two Print Stencil Systems” on Wednesday, March 26, at 3:30 pm in the South Pacific F. The poster demonstrates two print stencil systems for:

  • Printing solder paste for SMT and through-hole intrusive reflow.
  • Printing solder paste for SMT and RF shields.
  • Printing solder paste and glue.
  • Printing solder paste and flux for SMT/flip chip assembly.
  • Printing solder paste on two different PCB levels.

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