Fundamental Considerations to EMC and High Speed Signal Behavior on PCBs

Following Albert Einstein’s model of making things as simple as possible, but not simpler, you too, can become an EMC-competent board designer by understanding what happens, rather than merely learning rules.

On Monday, March 24, 2014, from 2:00 pm to 5:00 pm, I, along with course attendees will examine sources of RF; electric and magnetic dipole antenna structures; and near-field arrangement that generate common and differential mode currents and create crosstalk and far-field radiation. Using 3-D field simulation, I will demonstrate design techniques for trapping RF generated by various applications.

In addition, my professional development course (PD26) at IPC APEX EXPO, “Becoming an EMC-competent Board Designer by Understanding What Happens Rather than Learning Rules,” will detail:
• Design rules and samples of EMS and high-speed PCB design
• Influence of connector placement on external noise
• Role of line and power structures in EM-field and high-speed signal propagation
• Current density distributions of different signal structures (single-ended and differential lines) to reconfirm proposed design structures
• Effects of slotted ground planes under signal traces and high-speed signal propagation switching between reference planes as demonstrated by 3-D field simulation with signal energy flow; and recommendations for optimal signal path and reference plans arrangement
• The influence of 90 trace inflections and non-matching differential trace length for high-speed signals as demonstrated by 3-D EM field simulation with signal integrity distortion

Learn to understand the impact of EMC on PCBs beyond the rules by joining me on Monday, March 24.

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