IPC Standards Committee Reports: Base Materials, Fabrication, High Speed/High Frequency, Embedded Devices

These standards committee reports from IPC’s Fall Standards Development Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second report in the series.

Base Materials

The 3-11 Laminate/Prepreg Materials Subcommittee is revising IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards to its D revision and will send a final draft for comments later this month. The standard will have six new specification sheets and eight specification sheets from the C revision will be removed (sent to an archive). Additionally, the subcommittee addressed re-writing IPC/CPCA-4105 on laminate material for primary use as substrate for LED lighting applications.

The 3-11f UL/CSA Task Group discussed the UL 746E ANSI FR-4 category that was divided into FR-4.0 and FR-4.1 and its impact on industry. So far, industry is working well with these two subcategories and UL is implementing them easily. No other problem areas were identified with either UL 746E or 796 standards from an industry perspective.

The 3-11g Corrosion of Metal Finishes Task Group discussed metal finish corrosion on component leads and printed board surface finishes. Work continues on mixed flowing gases (MFG) testing with exposed copper as well as silver and a five-day exposure and flowers of sulfur (FoS) testing. The latter is an easier and safer test to run, so it is expected that an IPC-TM-650 test method will be developed sooner with the FoS method.

The 3-12a Metallic Foil Task Group addressed the non-contact surface roughness test (proposed TM 2.2.22) by reviewing /changing Draft 7 and pushing it to a Draft 8 by the end of the meeting. Subsequent teleconferences will be held in the coming weeks to advance the TM 2.2.22 method.

The 3-12d Woven Glass Reinforcement Task Group addressed a proposed definition of “spread glass.” Hard copies of the newly released, IPC-4412B, Specification for Finished Fabric Woven from “E” Glass for Printed Boards, were distributed to task group members in attendance as a reward for their efforts in generating the B revision. The group also reviewed a new ultralight glass weave, identified as weave style 1010. This style will be added as an amendment to IPC-4412B.

Fabrication Processes

The 4-14 Plating Processes Subcommittee discussed revision efforts on IPC-4552, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, which needs a full update from its 11-year-old original release. Primarily for those attendees who have not participated in regular teleconferences, one of the co-chairs reviewed the status of work underway. The subcommittee believes that additional members will join efforts to generate IPC-4552A.

High Speed/High Frequency

The D-23 High Speed/High Frequency Base Materials Subcommittee reviewed a proposed Amendment 1 to the December 2011 release of IPC-4103A, Specification for Base Materials for High Speed/High Frequency Applications. The amendment will replace the free download of errata and additional errors/changes that have been discovered. The final draft of Amendment 1 was circulated for comments (none were received), so the amendment will enter ballot.

Embedded Devices

The D-55 Embedded Devices Process Implementation Subcommittee discussed the status of IPC-7092, Design and Assembly Process Implementation for Embedded Components. This document describes the design and assembly challenges for implementing passive and active components in either formed or inserted methodology on a printed board. The new standard focuses on fabrication and assembly processes and identifies various board types. The committee reviewed the draft and made a few minor modifications so that it is now ready for industry review.


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