IPC Standards Committee Reports — Assembly, Cleaning/Coating, Reliability, Testing, Assurance

Reports from IPC standards meetings at IPC APEX EXPO 2013 have been summarized to keep you up to date on committees’ work in advancing new and revised industry guidelines. This is the third report in the series.

Assembly and Joining

The 5-21f Ball Grid Array Task Group completed their work on IPC-7095C, Design and Assembly Process Implementation for BGAs, which was published prior to IPC APEX EXPO. The committee met to celebrate the success of this accomplishment and determine applicable future work that needed to be done on any issues related to BGA implementation. The members of the committee were congratulated for their work during an awards luncheon.

The 5-21h Bottom Termination Task Group reviewed the deliberations of the completion of IPC-7095C and considered an amendment or revision to the bottom termination components document, IPC-7093. Very few issues were identified; however, industry problems still exist with voiding of the thermal pad. These issues will be discussed during 2013 via email, and the committee will meet in the fall for a detailed review of new requirements needed enhance IPC-7093.

The 5-21jnd Solder Paste Task group released IPC-7527, Solder Paste Printing Acceptance Guide for publication.

The 5-21k IPC-SM-817 SMT Adhesive Task group has re-formed and is opening the IPC-SM-817, General Requirements for Dielectric Surface Mounting Adhesive for revision and update to revision A.

The 5-22a J-STD-001 Task Group reviewed nearly 75 open action items and comments to J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies. This task group met a second day to resolve comments on criteria common to both J-STD-001 and IPC-A-610, Acceptability for Electronic Assemblies.

The 5-23a Printed Circuit Board Solderability Specifications Task group completed work on the J-STD-003C, Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process Sensitive Components revision. This document will be going out for ballot after the addition of some figures.

The 5-24a Flux Specifications Task Group reviewed and revised Test Methods: 2.3.32 – Copper Mirror, 2.6.15-Corrosion, – Quantitative Halides, – SIR, 2.3.33 – Silver Chromate, – Fluoride Spot.

The 5-24b Solder Paste Task Group began review of all test methods originating with the group and discussed the need for revising IPC-HDBK-005, Guide to Solder Paste Assessment.

The 5-24c Solder Alloy Task Group reviewed comments received during the first round of balloting on the proposed C revision of J-STD-006, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications. Comments were resolved and some technical changes were made to the standard. The ballot will now go back to the task group for a second round of balloting. Balloting should close at the beginning of April with possible publication by mid-year 2013.

Cleaning and Coating

The 5-31g Stencil Cleaning Handbook Task group is working on revision A of IPC-7526, Stencil and Misprinted Board Cleaning Handbook.

The 5-31j Cleaning Compatibility task group has been formed to develop a standard test method in place of Mil-Std-202 Method 215 to determine the compatibility of cleaning agents and mechanical delivery systems with general electronic assemblies, component hardware and electronic assembly materials. Currently, Mil-Std-202 and the 215 test method do not accurately represent modern cleaning chemistries and the cleaning equipment advancements that are currently used within electronic assembly manufacturing processes.

The 5-32a Ion Chromatography/Ionic Conductivity Task Group is developing a component method. This test method could potentially be used as a secondary approach to evaluating counterfeit parts.

The 5-32b Surface Insulation Resistance Task Group discussed the development of an SIR test pattern library.  This group received a report on the updated IPC-B-52 test board.

The 5-32c Bare Board Cleanliness Assessment Task Group reviewed concepts for a future IPC-5705 guideline that would provide insight into how to qualify a printed board fabricator in accordance with IPC-5704, Cleanliness Requirements for Unpopulated Printed Boards.  In the future, IPC printed board specifications such as IPC-6012 are expected to call out IPC-5704 as part of overall requirements for fabrication of production lots of printed boards.  When this happens, having a document such as IPC-5705 will be beneficial.  The group was not opposed to the concept, but requested that some cases studies be generated of those making use of IPC-5704 before approving an IPC-5705 effort.

The 5-32c Bare Board Cleanliness Assessment Task Group reviewed concepts for a future IPC-5705 guideline that would provide insight into how to qualify a printed board

The 5-32e Conductive Anodic Filament (CAF) Task Group addressed revision B of IPC-9691, User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament  (CAF) Resistance Test (Electrochemical Migration Testing).  The group agreed upon changes to sections 8 and 9 in the User Guide.  Additionally, because of a discrepancy between the CAF test method (TM 2.6.25A) and the User Guide IPC-9691A, the group decided that the preconditioning bake be changed in the test method from a minimum of 30 minutes to 6 hours.  Accordingly, revision B of the TM 2.6.25 will be pursued to include the new baking time plus any new test vehicle proposed designs.

The 5-33a Conformal Coating Task Group reviewed IPC-CC-830, Qualification and Performance of Electrical Insulation Compounds for Printed Board Assemblies, This group will be pursuing a C revision rather than an amendment. Revisions will include a test method for adhesion, address issues with testing and documentation on insulation testing results of 500 megohms vs. 5000 megohms, and the possible addition of a new generic type of conformal coating.

The 5-33c Conformal Coating Task Group has completed industry review of IPC-HDBK-830A, Guidelines for Design, Selection and Application of Conformal Coatings. This document will be going out for ballot in the next quarter.

The 5-33f Potting and Encapsulation Task Group celebrated the publication of IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.

Product Reliability

The 6-10c Plated-Through Via (PTV) Reliability Task Group reviewed industry comments to the final draft of IPC-TM-650, Method 2.3.35, Capacitance of Printed Board Substrates after Exposure to Assembly, Rework and/or Reliability Tests.  The test method is intended as an optional procedure that may be called out within the corresponding IPC-TM-650, Method 2.6.26A, DC Current Induced Thermal Cycling, which is itself undergoing an A revision that includes updates to the current procedure centered on the interconnect stress test (IST) design and a second procedure based on the current induced thermal cycling (CITC) procedure developed by Endicott Interconnect Technology.   The group focused on examples of material degradation that may trigger suggested failure thresholds in the 2.3.35 method, including delamination, cohesive fracture, crazing and material decomposition.

The new 6-11 Printed Board Coplanarity Subcommittee addressed industry comments to the final draft of IPC-9641, High Temperature Printed Board Flatness Guideline. While IPC has test methods that address the overall planarity (bow and twist) of a printed board, this new IPC guideline will address localized planarity of the board at package locations under thermal stress.  The document will be going out for ballot later in March.


IPC staff  provided the 7-11 Test Methods Subcommittee with an overview of a new tracking system within IPC that will alert originating task groups (OTGs) of IPC-TM-650 Test Methods when their test methods have reached a five-year milestone from release.  The goal is notify OTGs of when a test method should be considered for revision, reaffirmation, or cancellation so as to maintain the validity and value of individual IPC-TM-650 test methods.

The 7-12 Microsection Subcommittee reviewed industry comments on the draft revisions of IPC-TM-650, Method 2.1.1F, Microsectioning, and Method, Microsectioning – Semi or Automatic Technique Microsection Equipment (Alternate). The subcommittee expressed interest in merging the two test methods into a single test method.

Product Assurance

The 7-31b IPC-A-610 Task Group reviewed more than 100 open action items and comments to IPC-A-610F, Acceptability of Electronic Assemblies. This task group met a second day to resolve comments on criteria common to both IPC-A-610 and J-STD-001. Several new SMT termination styles are being considered for addition to both of these standards.

The 7-31f Wire Harness Acceptability Task Group celebrated the publication of IPC/WHMA-A-620B, Requirements and Acceptance for Cable and Wire Harness Assemblies. Several conflict issues have been identified and the task group will be developing an amendment. A task group meeting to resolve the technical contents has been scheduled for May 23 in conjunction with IPC ESTC — Electronic System Technologies Conference & Exhibition.

The 7-31fs Space Electronic Assemblies IPC/WHMA-A-620 Addendum Task Group worked through nearly 40 open comments against this addendum. IPC staff will be preparing this addendum for ballot.

The 7-31h IPC-HDBK-620 Task Group and 7-31k Wire Harness Design Task Group have combined to work on their respective documents. This group has a first draft of IPC-D-620, Wire Harness Design. The IPC-HDBK-620 guidelines document is on hold in favor of the design standard.

The 7-31j Requirements for Structural Enclosure Task Group completed the first ballot of IPC-HDBK-630, Structural Enclosure Guidelines Handbook. The task group received comments on the document and will hold teleconferences to resolve those comments. Pending the outcome of comment resolution, the document may go back out for a second ballot. In addition, the task group has a first draft of the IPC-A-630. The task group has reviewed the entire document and is now collecting additional content and comments from the task group at large. IPC-A-630 should be available for industry review in April.

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