Taking a Closer Look at ‘Part E’ (Assembly Technology) of the 2013 IPC International Technology Roadmap for Electronic Interconnections

By Jasbir Bath, principal engineer, IPC

The recently released, 2013 IPC International Technology Roadmap for Electronic Interconnections is a valuable resource for companies throughout the global electronics manufacturing industry who are embarking on business, technology and strategic planning for the near and long term.

New features of the IPC roadmap include a “stewardship” section that provides expanded content and scope, with an emphasis on true sustainability; explanation of new business models and expanded coverage of the printed electronics industry as it matures into a viable technology.

The IPC roadmap consists of five sections: Part A – provides information on how to use the roadmap; Part B – covers technology trends; Part C – addresses design considerations; Part D – tackles interconnections and substrates; and Part E covers assembly technology.

Taking a closer look at Part E on assembly technology, Section E1 discusses the general requirements for electronics assembly.

This section covers the current status of the industry in relation to components (active and passive), solder materials (for surface mount, wave and rework), equipment (printer, SMT placement, dispensing, reflow and wave), process capabilities, component and board warpage and assembly test (SPI, AOI, AXI, ICT, manufacturing defects analyzer, flying probe, boundary scan).

The “needs section” highlights needs at the industry level for components, solder materials, equipment (including test and rework).

The “challenges section” goes into greater detail on component assembly (BTC/QFN, PoP, CSP), component and board warpage, board feature location tolerances, rework, reliability and test.

The next section discusses potential solutions and paradigm shifts in the industry and the “conclusions section” summarizes some of the key areas discussed.

Additional highlights of Section E1 include:

  • Development of 0201 metric chip components
  • Trends in capacitor and resistor chip sizes
  • Miniaturization down to 0.3mm pitch CSP components
  • BGA/CSP component pitch trends by product type
  • PoP components
  • BTC/QFN/MLF components
  • SnPb and lead-free (high silver and low silver) solder alloys and standards related with their use
  • SMT, wave and rework trends and standards affecting these areas such as copper barrel knee plating thickness for wave and rework processes
  • Board feature location tolerance standards and their impact on component placement of fine pitch small components
  • Component and board warpage
  • Equipment roadmaps and test
  • SMT component placement accuracy trends
  • Solder paste inspection equipment challenges for measuring small paste deposits and equipment performance verification

In Section E, there are also four additional sub-sections focusing in more detail on specific areas of the assembly industry including Interposer and Module Assembly (E2), Portable Product Board Assembly (E3), General Product Board Assembly (E4) and Backplane Assembly (E5).

For more information or to purchase 2013 IPC International Technology Roadmap for Electronic Interconnections, visit www.ipc.org/technology-roadmap 

 

 

2 Comments

  1. Posted March 26, 2013 at 11:30 pm | Permalink

    I want to purchase 2012 Road map.
    Please indicate the procedure.

    Regards.

    Amba Prasad.

    CID++


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