View from Europe: Solderability and Reliability in Focus at IPC Conference in Budapest

By Lars Wallin, IPC European Representative

At the IPC Conference on Solderability and Reliability for Electronics Assemblies in Budapest, Hungary, 130 attendees gathered on February 6–7, to learn more about IPC standards and how these documents are good resources for improving quality, making better materials choices, and achieving “the perfect solder joint.”

Mission to Inform

Five workshops and a one-and-a-half day technical conference were presented to assist attendees in reaching their manufacturing goals. In addition, 10 tabletop exhibitors showcased the next generation of services and equipment.  Technical conference presenters included Bob Willis, BobWillisOnline.com , who presented package-on-package (PoP) technology; Gabriele Sala, GS Consultants, who gave an in-depth look at the effect of heat and moisture on electronic components; and Fern Abrams, IPC, with an overview of regulatory trends that are changing the way electronics companies do business, including RoHS revisions, the growing concern about chemicals, corporate social responsibility and conflict minerals.

IPC Standards Should be Used Throughout the Supply Chain

Calculations presented during the conference show that more than 140 parameters exist in the entire electronic production chain of an assembled, soldered and tested board. Each parameter can have from one to 30 different variables — meaning that the theoretical number of combinations are more than 6,000,000,000,000,000 — a number so large that it impossible for the human brain to have control over all of them. A good tool to have a much better control over all these parameters and its variables is to use IPC standards in the entire production chain. By adhering to requirements within IPC standards during production, costs can be reduced, ultimately benefitting suppliers and customers.

EMS Growth in Central Eastern Europe

The afternoon of the first day of the conference was dedicated to a roadmap of the electronic industry in Eastern Europe. Peter Brent,  Reed Electronics Research, presented a number of statistics that showed a positive future in the coming years. In addition, a panel discussion with representatives from Nordson Dage, Alpha and Balver Zinn addressed considerations/parameters for placing operations in Eastern Europe. Panel representatives also see a positive future for Eastern European manufacturing
operations.

Future Plans for the Conference

IPC intends to organize a similar event in 2014 in conjunction with IPC distributors in Hungary, Poland, Romania, Czech Republic and Turkey. The goal of the event will remain the same: to help EMS providers and OEMs based in Eastern Europe learn about industry advancements and understand how IPC standards can help them meet deadlines, avoid costly mistakes and satisfy customers.

Panel discussion representaties

Panel discussion representatives

Conference attendees

Conference attendees

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