Presentations from Underwriters Laboratories, iNEMI and IPC’s Roadmap committee on Thursday carried a couple common threads. These IPC APEX EXPO® sessions stressed the importance of working together and taking a big picture view.
IPC is working with UL to help upgrade UL’s requirements for substrates. Sharing roadmap information is one of many projects where iNEMI and IPC work in coordination. This sharing of information only goes so far – both groups feel it’s beneficial to view technology from different vantages to get a true picture of what’s going on.
The efforts also highlight a growing trend in the design and manufacturing worlds. As systems get more complex and difficult to manufacture, development teams have to look at every facet of a product to get a true picture of how the pieces all come together.
IPC is taking another pathway to help developers understand the broad picture of their design and production programs. In May, IPC is bringing a number of top executives from leading companies throughout the supply chain to help members understand the benefits that come when they take an all-inclusive view of their projects.
The IPC Electronics Systems Technologies Conference and Exhibition has a roster that’s tough to beat. Keynoters from Intel, Lenovo, Microsoft, Medtronic, Cadence Design Systems, STATS ChipPAC, Amkor Technology, and Multitest will all offer insight into their areas of expertise.
Add in the usual professional development courses, a large exhibit hall and technical sessions, and you’ve got plenty of good reasons to be in Las Vegas May, 20-23.