Honoring Committees

Creating a standard takes a tremendous amount of time and effort. There’s lots of information to understand before committee members can decide how alternative solutions will be handled.

That’s true for all committees. But some always have a few more concerns than others, making standards development a bit harder. At Wednesday’s IPC APEX EXPO® Awards Luncheon, IPC honored committee members who completed documents that had more issues to resolve than normal.

IPC-7095C, Design and Assembly Process Implementation for BGAs, was the first of the standards to earn recognition. IPC-7095C looks at factors like cratering, helping manufacturers avoid craters and other defects.

The team that developed IPC-2221B, Generic Standard on Printed Board Design, was also honored. It’s a broad document that addresses nearly every aspect of a printed board’s lifetime.

While most of the committees work on standard revisions, some start from scratch. An award went to the group that started from nothing to develop IPC-4456, Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards.

IPC has also gotten involved in another new area, printed electronics. Standards are among the efforts in place to help build an infrastructure for this rapidly emerging field. Awards went to members of the committee that developed IPC/JPCA-4591, Requirements for Printed Electronics Functional Conductive Materials.

Another committee won recognition for developing IPC-4203A, Cover and Bonding Material for Flexible Printed Circuitry. They added a number of aspects needed to create the latest in flex circuitry.

Though technology is the main focus for IPC, design and production don’t happen without the business side of things. IPC also examines market data. Another honoree was Karen Moore-Watts in appreciation and recognition of her leadership and valuable service as chair of the IPC SMEMA Statistical Subcommittee since 2007.

 

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