Are you getting all of your IPC member benefits? Don’t miss a thing!

IPC is pleased to provide you with this update of free member benefits available to everyone at your member site. This reminder is current to November 1, 2012 and member log-in is required. If you don’t know your user name or password, visit and select “Forgot Your Password or User Name?” or, if appropriate, select “New User? Find your user name and password here.” To become a member, please contact IPC Director of Membership Neal Bender at

This is to ensure that you are fully up-to-date on access to new and updated standards, research, presentations, white papers and more.  We hope these resources, available to you at no charge as a benefit of membership, will be helpful and we look forward to supporting you and promoting your company’s growth.

World PCB Production Report for the Year 2011
Published annually, this report offers consensus estimates of PCB production value by country and by product category, and analysis of global and regional PCB industry trends. Special sections on the metal core PCB market and HDI/microvia board trends, applications and forecasts are included in this year’s report.
Released September 2012

Market Data Update
This quarterly business report brings together the latest market data from many segments across the supply chain. Covering metals, solder, chemicals, assembly equipment, laminates, PCB’s, EMS, end-product industries and macroeconomic trends, it offers readers a comprehensive view of industry dynamics. Every issue includes leading indicators to help readers plan for changes in their business environment.

VIDEO RECORDED PRESENTATIONS – Online Presentation Library
The following presentations were recorded live at the IPC Executive Summit, August 21, 2012 in Schaumburg, IL.

Technical Presentation
Manufacturing with Fiber Optics (Matt Hamand of Rockwell Collins)

Management Presentations
Environmental Policy and Corporate Social Responsibility (Fern Abrams of IPC)

Overview of Latin America’s Economy and the Electronics Industry (Sree Bhagwat of IPC)

Creating and Following the EMS Dashboard (Rick Herndon of Firstronic, LLC)

Creating and Following the EMS Dashboard (David Hollingsworth of Ascentron, Inc.)

Where is the Gap? What Our Customers Need from Us (Scott Meyer of UTC Aerospace Systems)

Where is the Gap? What Our Customers Need from Us (Michael Goeringer of Arc-Tronics)

How to Achieve High Speeds Without Breaking the Bank (Mike Freda of Oracle’s Semiconductor Packaging & Technology Group)

Breaking Into Game Changing Technologies: Embedded (Jim Fuller of Endicott Interconnect Technologies, Inc.)

HDI-Altering the Competitive Landscape for North America (Mike Carano of OMG Electronic Chemicals)

IPC Midwest 2012 Technical Conference Proceedings (August 22-23, 2012) Schaumburg, IL
Proceedings from this technical conference include 16 presentations from five sessions titled: Reliability Challenges for Bottom Termination Components; Assembly Coatings and Alternatives; Advances in Reliability Testing; Application Processing for Solder Related Materials and Assembly Process Soldering Materials.

Requirements and Acceptance for Cable and Wire Harness Assemblies (IPC/WHMA-A-620B)
Revision B remains the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. It includes greatly expanded criteria for molding, potting, splicing, crimp contacts without insulation support, inline insulation displacement connectors, connectorization, rigid and conformable cables, flexible sleeving, broomstitching, testing and more! Included are criteria for wire prep, soldering to terminals, crimping of stamped and formed contacts and machined contacts, insulation displacement connectors, ultrasonic welding, splicing, connectors, molding, marking, coax/biax cables, wrapping/lacing, shielding, assembly and wire-wrap terminations.
Released October 2012
*Due to the size of the document and number of illustrations, IPC members may request one free single-user download OR hard copy by visiting

IPC members may request a free single user download of a document with digital rights management of each new standard below within 90 days of publication by e-mailing

Requirements for Soldered Electrical and Electronic Assemblies – (J-STD-001E-RO) Romanian language
Translation released September 2012

Printed Circuit Assembly Strain Gage Test Guideline – (IPC-9704A-CN) Chinese language
Translation released September 2012

Acceptability of Electronic Assemblies – (IPC-A-610E-NL) Dutch language
Translation released September 2012

Stencil and Misprinted Board Cleaning Handbook – (IPC-7526-RU) Russian language
Translation (available in hard copy only) released September 2012

IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices – (J-STD-020D-1-RU) Russian language
Translation (available in hard copy only) released September 2012

SMT Process Guideline & Checklist (IPC-S-816-RU) Russian language
Translation (available in hard copy only) released September 2012

Requirements for Electrical Testing of Unpopulated Printed Boards (IPC-9252A-CN) Chinese language
Translation released September 2012

Requirements for Solder Paste Printing (IPC-7527-DK) Danish language
Translation released October 2012

Membership extends to everyone at your location so please inform others in your organization that they can use IPC as a tool to achieve their business objectives. Login and password information can be retrieved by visiting and selecting either “New User? Find your user name and password here.” or “Forgot your password or user name?” Questions? Please send an e-mail to

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