IPC Standards Committee Reports – Printed Board Design, Data Generation/Transfer, Electronic Documentation, High Speed/High Frequency

The fourth and final posting in a series of updates from IPC standards committee meetings held at IPC Midwest.

Printed Board Design

The 1-10c Test Coupon and Artwork Generation Task Group finalized changes to the A/B-R plated through hole evaluation coupon design that has been approved as a replacement for the legacy A and B and A/B test coupon designs.  The AB/R design is being incorporated into the B revision of IPC-2221, Generic Standard on Printed Board Design, which is expected to be released in the fall of 2012.

Data Generation and Transfer

The 2-16 Product Data Description (Laminar View) Subcommittee discussed new requirements to be added to the XML schema of the proposed IPC-2581A, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology. The group discussed the coordination needed between electronic documentation identified as IPC-2614-1 and IPC-2614-2.

Electronic Documentation Technology

The 2-40 Electronic Documentation Technology Committee discussed the status of the IPC-2610 series, which includes hard copy, electronic copy and machine-usable data. The committee discussed continued development of IPC-2616 (assembly) and IPC-2617 (testing), but was more concerned about potential user’s guides for defining laminate and printed board characteristics in the code format according to IPC-2581A. A detailed strategy was developed for new drafts and outlines of the 261X series.

The 2-41 Laminate Description Task Group reviewed the status of the document that was to be IPC-1753. The group determined UML model conditions for the document that will become essentially a user’s guide for describing laminate according to IPC-2581A.

High Speed/High Frequency

The D-22 High Speed/High Frequency Board Performance Subcommittee discussed formats to future revisions of IPC-6018, Qualification and Performance Specification for RF/Microwave Printed Boards.  There was debate as to whether to keep IPC-6018 independent of the main IPC-6012 rigid printed board specification, thereby retaining redundant acceptance criteria, or transform it into a document that only addresses criteria specific to high frequency boards, and that require usage with IPC-6012 for printed board procurement.  The subcommittee will develop a comparative spreadsheet of IPC-6012, IPC-6013 and IPC-6018 requirements to see how many unique requirements exist outside of the base IPC-6012 specification.

One Trackback

  1. By Frequency standards | Huecisto on September 28, 2012 at 12:26 am

    […] IPC Standards Committee Reports – Printed Board Design, Data … […]

Post a Comment

Required fields are marked *

*
*

%d bloggers like this: