IPC Standards Committee Reports — Assembly, Cleaning/Coating, Product Reliability, Testing, Product Assurance

The third posting in a series of updates from IPC standards committee meetings held at IPC Midwest.

Assembly and Joining

The 5-21f Ball Grid Array Task Group reviewed comments received on the C revision of IPC-7095, Design and Assembly Process Implementation for BGAs. Many of the revisionsdeal with cratering anomalies and new termination types and also consider mechanical stress testing for area array assemblies. Comments will be incorporated and a 10-day ballot circulated for approval. The goal is to publish the document by the end of 2012.

The 5-21jnd Solder Paste Task group released IPC-7527, Solder Paste Printing Acceptance Guide for publication.

The 5-24a Flux Specifications Task Group reviewed and revised Test Methods: 2.3.32 – Copper Mirror, 2.6.15-Corrosion, – Quantitative Halides, – SIR, 2.3.33 – Silver Chromate, – Fluoride Spot.

The 5-24b Solder Paste Task Group began review of all test methods originating with the group and discussed the need for revising IPC-HDBK-005, Guide to Solder Paste Assessment.

The 5-24c Solder Alloy Task Group continued review of a proposed C revision of J-STD-006, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.

Cleaning and Coating

The 5-32a Ion Chromatography/Ionic Conductivity Task Group is developing a component method. This test method could potentially be used as a secondary approach to evaluating counterfeit parts.

The 5-32b Surface Insulation Resistance Task Group discussed the development of an SIR test pattern library. A presentation was given by Plexus staff on upcoming efforts by the High Density Packaging User’s Group (HDPUG) for a new project that will further investigate electro-chemical migration exposures created by no clean flux residues on PCBAs.

The 5-32c Bare Board Cleanliness Assessment Task Group reviewed industry comments to the Final Draft of IPC-5703, Cleanliness Guidelines for Printed Board Fabricators. This document will serve as a follow-up and companion document to the existing IPC-5702, Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards. The document is expected to go to ballot in late 2012.

The 5-32e Conductive Anodic Filament (CAF) Task Group advanced the IPC-9691 User’s Guide to its B revision. The task group also reviewed a very detailed CAF test coupon design proposed by IBM.

The 5-33a Conformal Coating Task Group reviewed IPC-CC-830, Qualification and Performance of Electrical Insulation Compounds for Printed Board Assemblies, Amendment 1 to address issues with testing and documentation on insulation testing results of 500 megohm changing to 5000 megohm. In addition, this task group is considering an adhesion test method.

The 5-33f Potting and Encapsulation Task Group celebrated the publication of IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.

Product Reliability

The 6-10c Plated-Through Via (PTV) Reliability Task Group reviewed industry comments on IPC-TM-650, Method 2.6.26A, DC Current Induced Thermal Cycling. The A revision process includes updates to the current procedure centered on the Interconnect Stress Test (IST) design as well as a second procedure based on the current induced thermal cycling (CITC) procedure developed by Endicott Interconnect Technology.

The new 6-11 Printed Board Coplanarity Subcommittee met to unveil plans for IPC-9641, High Temperature Printed Board Flatness Measurement Methodology. IPC currently has test methods that address the overall planarity (bow and twist) of a printed board, but this new IPC guideline will address localized planarity of the board at package locations under thermal stress.


The 7-11 Test Methods Subcommittee announced the release of the new IPC-MDP-650 Method Development Packet. This new document provides originating task groups who wish to develop new test methods guidance on how IPC-TM-650 test methods should be structured and developed, along with requirements for validation and gage reproducibility and repeatability (Gage R&R) data.

The 7-12 Microsection Subcommittee reviewed industry comments on the draft revisions of IPC-TM-650, Method 2.1.1F, Microsectioning, and Method, Microsectioning – Semi or Automatic Technique Microsection Equipment (Alternate). Their goal is to update the methods with respect to different types of via constructions (blind, buried, staggered, etc.) and to advances in microsection preparation.

Product Assurance

The 7-31h (IPC-HDBK-620 Task Group) and 7-31k (Wire Harness Design Task Group) have combined to work on their respective documents. The first document in development is the IPC-D-620, Wire Harness Design Guidelines.

The 7-32c Electrical Continuity Task Group prepared the ballot for Amendment 1 of IPC-9252A, Requirements for Electrical Testing of Unpopulated Printed Boards, which provides clarification for automated test equipment for resistive isolation testing, as well as testing of accessible midpoints.

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