New releases – August 2012

Standards

Amendment 1 to IPC-4552, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards. Free Download of Amendment 1.

Amendment 1 to IPC-4554, Specification for Immersion Tin Plating for Printed Circuit Boards – includes Amendment 1. Free Download of Amendment 1.

HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly

Market Research
MR-FLEX12, 2011-2012 Analysis & Forecast for the Flexible Circuit Industry in North America

MR-PCBMARKET12, 2011-2012 Analysis & Forecast for PCB Industry in North America (includes the content of IPC’s rigid PCB and flexible circuit studies

MR-RIGID12, 2011-2012 Analysis & Forecast for the Rigid PCB Industry in North America

ONSHOR-12, On-Shoring in the Electronics Industry: Trends and Outlook for North America

Translations

7711/21B-RO, Refacerea, Modificarea și Reparația Ansamblurilor Electronice (Romanian Language)

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