New Releases in July 2012


2581A(D)FGeneric Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology — FREE download.

4921Requirements for Printed Electronics Base Materials (Substrates)

AMENDMENT 1 TO IPC-4552, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards – Includes Amendment 1, The amendment can be downloaded at no charge from the product listing for IPC-4552. Please note the abstract link is at the end of the abstract in red.

IPC/WHMA-A-620AS with Amendment 1 Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A Requirements and Acceptance for Cable and Wire Harness Assemblies – FREE download.


7527-DKKrav til Tinpastatryk (Danish Language).  This document was released in English in May 2012 as Requirements for Solder Paste Printing.

7711/21B-DENacharbeit, Änderung und Reparatur von elektronischen Baugruppen (German Language). This document was released in English in November 2007 as Rework, Modification and Repair of Electronic Assemblies.

IPC-4562A-CN印制板用金属箔 (Chinese language). This document was released in English in April 2008 as Metal Foil for Printed Board Applications.

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