IPC Member Benefits Update

For the convenience of the employees at IPC member sites, we are providing regular updates on free member benefits available to everyone at IPC member sites. Log-in is required to access these resources.

TECHNICAL PRESENTATIONS

The following presentations are from the JISSO International Council and Forum, produced by EIPC and SMTA in Nuremberg, Germany, May 6 – 11, 2012.  Each is posted with the permission of the presenter(s). If you have questions about a presentation, please contact the author directly if his/her e-mail is posted or IPC director of technology transfer at MarcCarter@ipc.org.

Design Technology

Computer Interface – Design to Manufacture – Dieter Bergman, IPC; Joe Clark, Downstream Tech

Embedded Technologies

Embedded Components in Automotive Application – Thomas Hofmann, Hoffman Leiterplatten

Approaches for Smart System Integration – Rolf Aschenbrenner, Fraunhofer-Institute

Microelectronics Packaging

Reviewing the Technology Challenges in Packaging Technology – Hirofumi Nakajima, Renesas Electronics Co.

3D Approaches for Heterogenous System Integration – Jurgen Wolf, Fraunhofer-Institute

Chip Package Interaction TSV Interposer Technology in North America – Claudius Feger, PhD, IBM Brazil; Vern Solberg, Invensas USA

Approaches for Smart System Integration – Rolf Ashenbrenner, Fraunhofer-Institute

xFD: Very Low Profile Multiple Die Package – Vern Solberg, Invensas USA

Printed Electronics

Printed Electronics (PE) Standards Development – Status and Strategy – Marc Carter, IPC; Dan Gamota, Printovate Technologies

Solders and Soldering

2nd Generation Pb-Free Solders for Reflow Soldering – Koji Serizawa, Senju-metal Industry Co., Ltd.

High Heat Proof Pb-Free Solder Technology – Koji Serizawa, Senju-metal Industry Co., Ltd.

Fatigue Acceleration Factor of SAC Joint – Dr. Y. Kariya, Shibaura Institute of Technology

NEW STANDARDS – FREE

IPC members may request a free single user download of a document with digital rights management of each new standard within 90 days of publication by e-mailing MemberTechRequests@ipc.org.

Acceptability of Electronic Assembiles – (A-610E-IL-Hebrew) Hebrew translation

Sectional Design Standard for Rigid Organic Printed Boards – (2222A-DE) German translation

Requirements for Soldered Electrical and Electronic Assemblies – (J-STD-001E-HU) Hungarian translation

Membership extends to everyone at a member location! Login and password information can be retrieved by going to www.ipc.org/members-only and clicking on either “New User? Find your user name and password here.” or “Forgot your password or user name?” For additional assistance, contact Susan Storck, IPC membership manager, at +1 847-597-2872 or SusanStorck@ipc.org or Jan Bakota, IPC membership coordinator, at +1 847-597-2809 or JanBakota@ipc.org.

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