IPC New Releases: June 2012


New Standards:

TM-650-MDP(D)F, Method Development Packet (Free Download)


  • A-610E-IL-HEBREW, Acceptability of Electronic Assemblies (Hebrew Language)
  • TECHTR-11E-CN, PCB Technology Trends (Chinese Language)
  • 2222A-DE, Sectional Design Standard for Rigid Organic Printed Boards (German language)
  • J-STD-001E-HU, Requirements for Soldered Electrical and Electronic Assemblies (Hungarian Language)


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