IPC APEX EXPO Standards Development Reports: Flex Circuits

 These committee reports from IPC APEX EXPO have been compiled to help you keep up on IPC standards. Visit www.ipc.org/committees for more information on standards development, drafts and minutes. The standards tree is another excellent reference with an organizational chart for IPC standards and contact information for the committee liaisons.

Here are the flex circuit committee activities from IPC APEX EXPO earlier in 2012:

The D-11 Flexible Circuits Design Subcommittee celebrated the release of IPC-2223C, Sectional Design Standard for Flexible Printed Boards. The subcommittee also reviewed goals for the next revision, including guidance on HDI/microvia structures and bend radii calculations.

The D-12 Flexible Circuits Performance Subcommittee continued work on revision C to IPC-6013, Qualification and Performance Specification for Flexible Printed Boards. The subcommittee addressed visual inspection ranges for printed boards containing HDI/microvia features, allowances for voids in stiffener surface areas, and minimum external conductor thickness after plating for various flexible printed board types.

The D-13 Flexible Circuits Base Materials Subcommittee successfully balloted IPC-4204A, Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry, and received complimentary hard copies of the A revision. The subcommittee continued its work on IPC-4203A by advancing it to Draft 18.  The subcommittee intends to complete the document by mid-year of 2012.

The D-15 Flexible Circuits Test Methods Subcommittee worked on the B revision of TM 2.4.17.1, covering the propogation tear strength of flexible film materials. The group was able to completely review and suggest updates to the document that will be reviewed by the subcommittee later in March.  The subcommittee is aiming to push TM 2.4.16 (addressing initiation tear strength of films) to its B revision.

Interested in flex? Learn more about the IPC Conference on Flexible Circuits, June 12-14, 2012, in Irvine, Calif.

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