IPC APEX EXPO Committees: IPC Roadmap and JNAC reports

Roadmap

The 8-41 Roadmap Subcommittee released the IPC Technology Roadmap for 2011  just prior to IPC APEX EXPO and officially began the process of creating the 2013 release. The subcommittee spent an all-day work session confirming the new, distributed-processing work model for the 2013 release and began assigning chapter team leaders and sub-chapter contributors, as well as identifying topic areas where additional recruiting is needed.

The IPC Roadmap can help you:

  • Gain insight into future technological advances and how the printed board and EMS industries will cope with expected changes in board, component and assembly technology from 2012 to 2020.
  • Get details of how these changes may impact virtually every operation on the manufacturing floor.
  • Enable your company to test its short- and long-term goals within a future technology landscape to help navigate the success of those goals.
  • Understand how anticipated changes in packaging, nanotechnology and optoelectronics technologies will impact you.
  • Learn how global material elimination directives affect material declaration, recycling and regulatory education.
  • See how the technology trends identified provide new methods for the integration of electronics into semiconductor packages and focus on electrical performance and miniaturization.
  • Compare aspects of your company’s products to the technology drivers of tomorrow using an exclusive software analysis program developed by the National Institute of Standards and Technology (NIST).
  • Get a sneak peek into new unique interconnections and assembly potential through dedicated chapters that introduce revolutionary applications still in the embryonic stage.

Learn more at www.ipc.org/roadmap.

JNAC

The Jisso North America Council (JNAC) discussed progress being made for JIC13 (Jisso International Council) which will be held in Nuremburg, Germany.  Since representatives from the JEC were available, the attendees developed a plan for the week of May 8-11 that encompassed IEC meetings, JIC meetings, and a Jisso International Forum (JIF) which will be open to the general attendees of the Hybrid Technology Conference being held during that same time period. Program brochures will be available mid-April.

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