IPC Standards Development Reports: Product Reliability, Test, Process Control and Product Assurance

These committee reports from IPC APEX EXPO should help you keep up on IPC standards. Visit www.ipc.org/committees for more information on standards development, drafts and minutes. The standards tree is another excellent reference with an organizational chart for IPC standards and contact information for the committee liaisons.

Product Reliability

The 6-10c Plated-Through Via (PTV) Reliability Task Group discussed revisions to IPC-TM-650, Method 2.6.26,  DC Current Induced Thermal Cycling. The revision process includes only updates to the current procedure centered around the Interconnect Stress Test (IST) design as well as a second procedure based on the Current Induced Thermal Cycling (CITC) procedure developed by Endicott Interconnect Technology (EIT).  The task group addressed tables that provide default testing values for both systems.

The 6-10d SMT Attachment Reliability Test Methods Task Group met to discuss concepts for the detection of pad cratering failures in-situ during printed board bending tests.  Existing methods address pull force at the pad level (IPC-9708) and physical strain for significant mechanical damage (IPC/JEDEC-9707).  The task group will explore developing a new methodology within the IPC-9700 series that provides for the detection of pad cratering by way of acoustic emission testing.


The 7-11 Test Methods Subcommittee reviewed comments to the draft of a new IPC-TM-650 method development packet. The goal of the document is to provide originating task groups who wish to develop new test methods guidance on how IPC-TM-650 test methods should be structured and developed.   The task group also reviewed the final draft of IPC-TM-650, Method 2.6.25A, Conductive Anodic Filament (CAF) Resistance Test: X-Y Axes.

The 7-12 Microsection Subcommittee reviewed industry comments to the draft revisions of IPC-TM-650, Method 2.1.1F, Microsectioning, and Method, Microsectioning – Semi or Automatic Technique Microsection Equipment (Alternate). Their goal is to update the methods with respect to different types of via constructions (blind, buried, staggered, etc.) and to advances in microsection preparation.

Process Control

The 7-23 Assembly Process Effects Handbook Subcommittee and 7-24 Printed Board Process Effects Subcommittee reviewed the status of two early drafts related to process effects: IPC-9111 for assembly and IPC-9121 for printed boards. The two subcommittees met separately, but coordinated through shared subcommittee membership on IPC’s online committee workspace, KAVI. Each subcommittee refined the 16 sections of its respective document with appropriate placeholders on the committee’s dedicated workspace. Sharon Ventress, U.S. Army Aviation & Missile Command, will serve as the 7-23 subcommittee co-chair.

Product Assurance

The 7-31b IPC-A-610 Task Group continued work on Revision F of IPC-A-610 Acceptability of Electronic Assemblies.

The 7-31f Wire Harness Acceptability Task Group resolved the final 80 comments against Revision B of IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies. This document will now have final review in preparation for ballot.

The 7-31fs Space Electronic Assemblies IPC/WHMA-A-620 Addendum Task Group made good progress to align the A-620 space addendum to the proposed A-620 Revision B.

The 7-31ft IPC/WHMA-A-620 Technical Training Task Group reviewed status of a new training program specific to the A-620 Space Addendum.

The 7-34 Repairability Subcommittee published seven free download procedures for the IPC-7711B/7721B, Rework, Modification and Repair of Electronic Assemblies. The new procedures are available for download at ipc.org.

The 7-35 Assembly and Joining Handbook Subcommittee celebrated the release of IPC-AJ-820A, Assembly and Joining Handbook.

The 7-34t Repair Training Technical Committee reviewed several suggestions for the IPC-7711/7721B Rework, Modification and Repair of Electronic Assemblies training and certification program.

Questions? Want to serve on a committee? Send an e-mail to answers@ipc.org.

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