IPC Committees Welcome New Chairs

The following individuals have been nominated and have accepted new positions as chairs, co-chairs or vice-chairs of standards development and management council committees. IPC gives them a hearty handshake, wishes them well in completing their missions and thanks them in advance for their efforts!

2-18j Lab Report Declaration Task Group chair:  William Haas, Seagate Technology

2-18h Conflict Minerals Data Exchange Task Group co-chairs: Michael Hutchings, Oracle America, Inc.; John Plyler, Research in Motion

3-12d Woven Glass Reinforcement Task Group chair: Mike Bryant, BGF Industries Inc.; vice-chair: Douglas Eng, PPG Industries Inc.

5-24b Solder Paste Task Group co-chair: Karen Tellefsen, Cookson Electronics

6-10d SMT Attachment Reliability Test Methods Task Group vice chair: Vasu Vasudevan, Intel Corporation

610d-CN SMT Attachment Reliability Test Methods Task Group in China co-chairs: Hongbin Shi, ASEDA University and Link Zhang, Quanta Shanghai

7-23 Assembly Process Effects Handbook Subcommittee co-chair: Sharon Ventress, U.S. Army Aviation & Missile Command

E-30 Conflict Minerals Due Diligence Committee co-chairs: John Ciba, Brady Corporation; Joel Sherman, KEMET Electronics Corp.

IPC India Technical Advisory Committee
Core committee head: Professor Vedu Mitter, Sanmar Electronics Corp. Ltd.
Chairman: G.V. Mahesh, Indian Institute of Science

IPC PCB Suppliers Council Steering Committee chair: Richard (Rick) Lies, Chemcut Corporation

IPC SMEMA Management Council chair: Mark Wolfe, Phoenix International

IPC Technical Activities Executive Committee: Douglas Pauls, Rockwell Collins

One Comment

  1. Posted August 15, 2012 at 12:04 pm | Permalink

    Great informational resource as always!Thanks for sharing it with us..

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