IPC APEX EXPO Standards Development Reports: Assembly & Joining, Cleaning & Coating and Assembly Equipment

These committee reports from IPC APEX EXPO should help you keep up-to-date on what’s happening in IPC standards. Visit www.ipc.org/committees for more information on standards development, drafts and minutes. The standards tree is another excellent reference with an organizational chart for IPC standards and contact information for the committee liaisons.

Assembly and Joining

The 5-21e Solder Stencil Task Group celebrated the release of IPC-7525B, Stencil Design Guidelines.

The 5-21f Ball Grid Array Task Group reviewed the results of the balloting for Revision C of IPC-7095, Design and Assembly Process Implementation for BGAs. The task group made decisions on proposed editorial and technical changes. A revised draft will be recirculated for final ballot approval.

The 5-21jnd Solder Paste Printing Task Group sent IPC-7527, Solder Paste Printing Acceptance Guide to ballot.

The 5-22a J-STD-001 Task Group continued work on Revision F of J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies.

The 5-22f J-STD-001 Handbook Task Group celebrated publication of IPC-HDBK-001E, Handbook and Guide to Supplement J-STD-001.

The 5-23b Component and Wire Solderability Specification Task Group successfully balloted J-STD-002C, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires. The standard will be published upon final approval from JEDEC and other involved groups.

The 5-24a Flux Specifications Task Group celebrated the release of J-STD-004B, Requirement for Solder Fluxes, Amendment 1.

The 5-24b Solder Paste Task Group celebrated the release of J-STD-005A, Requirement for Solder Pastes.

The 5-24c Solder Alloy Task Group opened J-STD-006B, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications for revision.

The 5-24f Underfill Adhesives for Flip Chip Applications Task Group addressed comments to the proposed A revision to J-STD-030, Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micro Packages.

Assembly Equipment

The 5-41 SMT Component Placement Equipment Subcommittee celebrated the release of IPC-9850A, Surface Mount Placement Equipment Characterization.

Cleaning and Coating (Boards and Assemblies)

The 5-31g Stencil Cleaning Task Group reviewed proposals for Revision A of IPC-7526, Stencil and Misprinted Board Cleaning Handbook.

The 5-32a Ion Chromatography/Ionic Conductivity Task Group resolved industry comments to revision D for IPC-TM-650, Method 2.3.25, Detecting and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract, as well as revision B for IPC-TM-650, Method 2.3.28, Ionic Analysis of Circuit Boards, Ion Chromatography Method.

The 5-32b Surface Insulation Resistance Task Group announced the successful ballot completion of IPC-9203, User Guide for the IPC-B-52 Process Qualification Test Vehicle, which will serve as a user guideline for the IPC-B-52 SIR test board. The document will be published in April 2012.

The 5-32c Bare Board Cleanliness Assessment Task Group met to discuss plans for the final draft of IPC-5703, Cleanliness for Fabricators.  This document will serve as a follow-up and companion document to IPC-5702, Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards.

The 5-32e Conductive Anodic Filament (CAF) Task Group sent the final draft of TM 2.6.25A CAF test method to the 7-11 Test Methods Subcommittee for their review and comments. In addition, the task group concentrated on advancing the IPC-9691B User’s Guide.

The 5-33a Conformal Coating Task Group reviewed IPC-CC-830, Qualification and Performance of Electrical Insulation Compounds for Printed Board Assemblies, Amendment 1 to address issues with testing and documentation on insulation testing results of 500 megohm changing to 5000 megohm.

The 5-33c Conformal Coating Handbook Task Group successfully advanced IPC-HDBK-830, Guidelines for Design, Selection and Application of Conformal Coatings to its final draft and expects the document to be balloted within the next two months.

The 5-33f Potting and Encapsulation Task Group prepared IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly for ballot.

Questions? Please send an e-mail to answers@ipc.org.


Post a Comment

Required fields are marked *


%d bloggers like this: