New IPC standards, publications and translations February 2012

Busy month! Please click through the product ID links to learn more about any of the standards or presentations below:

New Standards and Revisions:

HDBK-001E, Handbook and Guide to Supplement J-STD-001

J-STD-005A, Requirements for Soldering Pastes

AJ-820A, Assembly & Joining Handbook

J-STD-033C, Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process Sensitive Components

9704A, Printed Circuit Assembly Strain Gage Test Guideline

Translations:

7711/21B-HU, Elektronikai szerelvények újramunkálása, módosítása és javítása (7711/21) (Hungarian Language)
A-610E-CZ, Kritéria přijatelnosti elektronických sestav (Czech language)

Reports:

WAGEE-11, IPC Wage Rate & Salary Report for the EMS Industry 2010-2011

Recorded Presentations:

MILMKT12-11-EMBCAP, Embedded Capacitor Technology; Status, Opportunity and Challenges

MILMKT12-11-FINFIN , Final Finish for Connectivity

MILMKT12-11-PWBTECHR , PWB Technology Roadmap

MILMKT12-11-RFPDOA , Is Your RFP D.O.A.

MILMKT12-11-TECRDMP, Technology Roadmap for Aerospace & Defense Electronics Assembly Industry

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