Burnish your skills in Budapest 20-22 March

With the new year beginning, make plans to do something new by attending the upcoming IPC Conference on Electronics Assembly in Budapest. The three-day event includes workshops, conference and a table-top exhibition. Learn more at www.ipc.org/budapest-conference.


Tuesday, 20 March, 2012: Half-Day Workshops
8:00 Registration, Networking Breakfast
9:00 Workshop 1: Why Are My Solder Joints Not Perfect? Methods for Analyzing and Recommended Actions to Solve the Problem and to Ensure That It Will Not Happen Again
Instructor: Lars Wallin, IPC European Representative
9:00 Workshop 2: Cleaning Printed Circuit Assemblies, Design & Process Control Workshop
Instructor: Bob Willis, ASKbobwillis.com
13:30 Workshop 3: Steps for Practical Failure Analysis
Instructor: Bob Willis, ASKbobwillis.com
13:30 Workshop 4: How Can Flex and Flex Rigid Boards Be a Technical and Economic Success in Electronic Products? A Detailed Survey of Economic Calculations, Design Rules, Choice of Material and Production Parameters
Instructor: Lars Wallin, IPC European Representative
Wednesday, 21 March, 2012: Exhibits & Conference Sessions
7:30 Registration, Networking Breakfast
8:30 Issues Which Impact the Quality and Reliability of an Assembled Board
Lars Wallin, IPC European Representative
9:00 Which PCB Surface Finish is Best and What Are the Common Failure Modes During Assembly & Operation
Bob Willis, ASKbobwillis.com
9:45 Break, exhibits
10:30 Low Melting Point Lead-Free Soldering Materials to Eliminate Board Assembly Process Steps While Avoiding Design Changes
Corne Hopperbrouwers, European Automotive Technology Manager, Alpha
11:10 Reliability of Fluxes Used in Selective Soldering Processes
Han Raetzen, Area Sales & Support Manager, Balver Zinn
11:50 Cost Effective Soldering with Micro Alloyed Solder Reducing Dross
Jens Gruse, Application engineering, Stannol Gmbh
12:30 Networking Lunch
13:30 Challenges with Step Stencils in the Printing Process
Carmina Lantzsch, Sales, LaserJob
14:10 Stencil Technology — State of the Art?
Lothar Pietrzak, Director Sales/Marketing, Christian Koenen GmbH
14:50 Break, Exhibits
15:35 Will Global Environmental Regulations and Corporate Responsibility Impact Product Reliability?
Tony Hilvers, Vice President of Industry Programs, IPC
16:15 FREE Keynote Address: Reliability Issues for Advanced Electronic Products
Dr. Dongkai Shangguan, Vice President of Advanced Technology, Flextronics
17:00 Networking Reception, Exhibits
Thursday, 22 March 2012: Exhibits & Conference Sessions
7:30 Networking breakfast, exhibits
8:30 The Closed Loop Project Between Screen Printer and SPI by PARMI
Woong Jang, Sales Manager, Quiptech
9:10 Cleaning Highly Dense Circuit Assemblies
Serge Tuerlings, Technical Manager Europe, Kyzen
9:50 Break, Exhibits
10:35 Cleaning Electronic Assemblies in a No-Clean World
Mike Nelson, Managing Director, ETEK Europe
11:15 Next Generation Board Repair
Tom Berx, Area Sales Manager, Soldering Systems & Printing Machines, ERSA
11:55 Depaneling Printed Circuit Boards — Tools and Methods for Safely Singulating Panelized PCBs
Klaus Heimann, President, FKN Systek
12:35 Networking Lunch
13:35 Inline Automation Inspection — Don’t Find Defects Only; Control Your Process Quality! Use the Information Which SPI, AOI and AXI Provide to Observe Quality Features and to Take Corrective Action Before Defects Occur!
Michael Muegge, Sales Engineer, Viscom AG
14:15 Technology Breakthrough in 2-D X-Ray
Keith Bryant, Global Sales Director X-ray Systems, Nordson Dage
14:55 Break, Exhibits
15:10 3-D AOI Technology
Harald Eppinger, European Sales Manager, Koh Young Europe
15:50 Failure Analysis — Reduce Your Costs with a Specialized, Independent Laboratory
Peter Gordon, Managing Director, EFI-labs Europe
16:30 Optimization of Cleaning PCB Assemblies and Stencil Through Process Examination
Vladimír Sitko (PBT), ELAS Kft
17:10 Adjourn

Keynote Speaker: Dongkai Shangguan, Ph.D., MBA, IEEE Fellow
21 March, 16:15
Dr. Shangguan is vice president and senior fellow with Flextronics. He has published two books, more than 250 papers and articles, and has given numerous technical presentations. He has more than 20 U.S. and international patents issued and a number of U.S. and international patents pending.

Learn more: www.ipc.org/budapest-conference

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