IPC Standards Committee Report – Assembly, Product Assurance, Process Control, Test, Cleaning/Coating, Reliability

This is part of a series of updates from IPC standards committee meetings at IPC Midwest.

Assembly and Joining

The 5-21f Ball Grid Array Task Group reviewed proposals for Revision C of IPC-7095, Design and Assembly Process Implementation for BGAs, and developed changes that had been identified in previous meetings. The first draft of Revision C was completed in July and comments were discussed during a teleconference and at the Midwest meetings.

The 5-23b Component and Wire Solderability Specifications Task Group addressed comments on J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires and is preparing the standard for ballot.

The 5-24b Solder Paste Task Group reviewed round robin test data on solder alloy ball size. In addition, J-STD-005, Requirements for Solder Pastes, is ready for ballot.

Cleaning and Coating

The 5-31 Cleaning and Alternatives Subcomittee celebrated the release of IPC-CH-65B, Guidelines for Cleaning of Printed Boards and Assemblies. The subcommittee plans on revising/updating Chapter 13 of the standard to include a more comprehensive discussion of the unique aspects of cleaning, repairing, and restoring assemblies. New legislations, changes in policies, or new processes will be reviewed and addressed in the form of technical or white papers as appropriate.

The 5-32a Ion Chromatography/Ionic Conductivity Task Group reviewed proposed changes to IPC-TM-650, Method 2.3.25C, Detecting and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract. The task group will also review a proposed test method from Foresite that provides a new procedure for extracting residues on printed board assemblies.

The 5-32b Surface Insulation Resistance Task Group reviewed edits to the working draft of IPC-9203, User Guide for the IPC-B-52 Process Qualification Test Vehicle, which will serve as a user guideline for the IPC-B-52 SIR test board. The task group recently completed IPC-9202, Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance, which was published in October 2011.

The 5-32e Conductive Anodic Filament (CAF) Task Group successfully advanced the TM 2.6.25A CAF test method to its final draft and sent it to the 7-11 Test Methods Subcommittee for their comments and/or approval for inclusion into the TM-650, Test Methods Manual. The group primarily worked on advancing the IPC-9691B User’s Guide to its Draft 5 stage.

The 5-33a Conformal Coating Task Group discussed how to qualify a new conformal coating material category for inclusion within IPC-CC-830B, Qualification and Performance of Electrical Insulation Compound for Printed Wiring Assemblies.

The 5-33c Conformal Coating Handbook Task Group is moving quickly toward a draft for industry review of IPC-HDBK-830, Guidelines for Design, Selection and Application of Conformal Coatings.

The 5-33f Potting and Encapsulation Task Group reviewed the draft of IPC-HDBK-850, a guideline on potting and encapsulation materials and processes. The goal is to release a draft for industry review before the end of 2011 with comment resolution at IPC APEX EXPO 2012.

Product Reliability

The 6-10c Plated-Through Via (PTV) Reliability Task Group discussed revisions to IPC-TM-650, Method 2.6.26, DC Current Induced Thermal Cycling. The revision process includes not only updates to the current procedure, centered around the interconnect stress test (IST) design, but a second procedure based on the current induced thermal cycling (CITC) procedure developed by Endicott Interconnect Technology (EIT). Both procedures will need to demonstrate gage reproduction and reproducibility data among each other, but not in comparison with one another. At this stage, the plan is to provide both procedures within a single test method.


The 7-11 Test Methods Subcommittee reviewed the draft of IPC-TM-650, Method Development Packet. The goal of the document is to provide originating task groups who wish to develop new test methods guidance on how IPC-TM-650 test methods should be structured and developed. The document will also include validation requirements for gage repeatability and reproducibility (R&R).The document is expected to go out for final draft review in November.

The 7-12 Microsection Subcommittee, reactivated in 2009, worked on draft revisions to IPC-TM-650, Method 2.1.1E, Microsectioning, and Method, Microsectioning — Semi or Automatic Technique Microsection Equipment (Alternate). Their goal is to update the methods with respect to different types of via constructions (blind, buried, staggered, etc.) and to advances in microsection preparation.

Process Control

The 7-23 Assembly Process Effects Handbook and 7-24 Printed Board Process Effects Subcommittees reviewed the status of two standards related to process effects: IPC-9111 for assembly and IPC-9121 for printed boards. The two subcommittees met separately, but coordinated through shared subcommittee membership. Each reviewed IPC’s new online committee workspace, KAVI, and refined the 16 sections of its respective document with appropriate placeholders on the committee’s dedicated workspace. Teleconference schedules throughout the year were established. An identified focus for 7-24 has been recruitment of additional/replacement subject matter experts for each of the subject chapters.

Product Assurance

The 7-31j IPC-A-630, Requirements for Structural Enclosure Task Group, discussed ideas on how to incorporate information from other industries (fasteners, plastics, cooling systems, healthcare and power tool) into IPC-A-630, Requirements and Acceptance for Environmental Structural Enclosure, High Performance Applications.

One Comment

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