IPC Standards Committee Reports: Design, Data Transfer, Documentation, high speeD, high frequency

IPC Standards Committee Reports from IPC Midwest Conference & Exhibition

Printed Board Design

The 1-10b Current Carrying Capacity Task Group discussed revisions to IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design. The task group wants to tap into industry testing for high current, high pulse applications, as well as flexible circuit technology and heavy copper. The difficulty lies in getting funding to create the designs and fabricate coupons for testing. The task group plans to seek out industry consortia that may be able to help.

The 1-10c Test Coupon and Artwork Generation Task Group discussed amendments to the A/B-R plated-through hole evaluation coupon design that has been approved as a replacement for the legacy A and B and A/B test coupon designs, as well as amendments to designs for the “W” solder wettability coupon and the “S” plated-hole solderability test coupon.

Data Generation and Transfer

The 2-10 Data Generation and Transfer Committee and 2-16 Product Data Description (Laminar View) Subcommittees discussed revision A of IPC-2581, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology. The committee incorporated comments submitted for inclusion prior to 2581 consortia format testing.

Supplier Declaration

The 2-18 Supplier Declaration Committee discussed minor changes to the XML schema that governs the IPC-175x family of data exchange standards. The changes helped make the XML schema more descriptive, which will help better identify individual sectionals that can be used within the 175x family of standards. The committee also reviewed possible amendments to the XML schema and IPC-1751A, Generic Requirements for Declaration Process Management.

The 2-18b Materials Declaration Task Group discussed the need to enhance adoption of IPC-1752A, Materials Declaration Management. The group decided that solution providers should be encouraged to develop an inexpensive form or user interface. IPC staff will reach out to solution providers requesting they develop such tools. The committee also discussed amendments to the text of the standard. However, these changes are dependent upon whether the 2-18 committee finalizes amendments to the XML schema. (See committee report above).

The 2-18c Laminate Declaration Task Group reviewed the status of IPC-1753 and determined UML model conditions for the standard. After review, the group decided that additional characteristics should be included in the model for flex material, ceramic material and silicon and determined the manner in which the XML modifications would identify base material with and without copper. These conditions will be incorporated in the first draft of IPC-1753.

The 2-18f Pack and Packing Materials Declaration Task Group discussed comments received on the draft standard, IPC-1758, Declaration Requirements for Shipping, Packing, and Packaging Materials. The committee hopes to have a final standard by February 2012.

The 2-18g Declaration of Batteries and Battery Materials Task Group decided that IPC-1759, Declaration of Batteries and Battery Materials, would only include questions not already included in IPC-1752A, Materials Declaration Management, or IPC-1751A, Generic Requirements for Declaration Process Management. The group also discussed the need for identifying use cases for battery declarations.

Electronic Documentation Technology

The 2-40 Electronic Documentation Technology Committee discussed the relationship of the IPC-261X and IPC-258X series of documents. Committee members took the outline developed at an interim meeting in Baltimore and discussed how these concepts would be incorporated into the new IPC-2616 and IPC-2617. The committee also discussed the methodology for reliability and techniques for product testing to incorporate in IPC-2617.

High Speed/High Frequency

The D-22 High Speed/High Frequency Board Performance Subcommittee discussed goals for a future revision to IPC-6018, Qualification and Performance Specification for RF/Microwave Printed Boards. The B revision to this specification passed ballot in September 2011 and is currently being prepared for publication. Key updates to this revision include a new concept for defining thermal zones in microsection evaluations, conductor spacing requirements and allowances for PTFE resin smear.

The D-23 High Speed/High Frequency Base Materials Subcommittee reviewed industry comments from the Final Draft circulation of IPC-4103A, Specification for Base Materials for High Speed/High Frequency Applications, which includes a new template for new material specification (slash) sheets. The concept utilizes a “tight/loose” slash sheet approach that has “tight” mandatory requirements for some attributes (Dk, Df, description) and “loose” requirements for others (e.g. thermal conductivity, moisture absorption) that can be certified to or called out on the fabrication drawings. The document is currently being circulated for ballot among the subcommittee members.

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