IPC committee status reports: Assembly and Joining, Assembly Equipment and Cleaning/Coating

Assembly and Joining

The 5-21F Ball Grid Array Task Group reviewed proposals for Revision C of IPC-7095, Design and Assembly Process Implementation for BGAs and developed changes that had been identified in previous meetings. The first draft of Revision C should be complete sometime in July.

The 5-22F J-STD-001 Handbook Task Group continued work on IPC-HDBK-001E, Handbook and Guide to Supplement J-STD-001. Significant progress was made and the task group will hold a summer meeting to try to have the handbook ready for ballot after IPC Midwest in September.

The 5-23A Printed Circuit Board Task Group is in the process of running wetting balance and flotation testing for data inclusion into revision C of J-STD-003, Solderability Tests for Printed Boards.

The5-23B Component and Wire Solderability Specifications Task Group discussed submitted comments on J-STD-002D, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires and is preparing the document for ballot.

The 5-24A Flux Specifications Task Group formed a ballot group and will cast their votes for Amendment 1 to J-STD-004B, Requirements for Solder Fluxes in mid-May and early-June 2011.

The 5-24B Solder Paste Task Group reviewed a series of round robin test data on solder alloy ball size. A draft for Revision A of  J-STD-005, Requirements for Solder Pastes, will be generated with the new data and circulated for comment.

The 5-24C Solder Alloy Task Group has asked for comments on the existing J-STD-006B, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications in order to proceed with Revision C.

The 5-24F Underfill Adhesives for Flip Chip Applications Task Group is considering opening J-STD-030, Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micro Packages, for revision. The new revision would be a combination handbook and specification standard similar to the format of IPC/WHMA-A-620A, Requirements and Acceptance for Cable and Wire Harness Assemblies.

Assembly Equipment

The 5-41 Component Placement Equipment Subcommittee discussed comments on IPC-9850A,

Surface Mount Placement Equipment Characterization, and made editorial changes throughout the document. The standard has been prepared for ballot.

Cleaning and Coating

The 5-31 Cleaning and Alternatives Subcommittee passed a unanimous ballot on IPC-CH-65B, Guidelines for Cleaning of Printed Boards and Assemblies, and is preparing the document for publishing.

The IPC 5-32B Surface Insulation Resistance Task Group reviewed comments to the final draft of IPC-9202, Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance. IPC-9202 is being developed ahead of companion document IPC-9203, User Guide for the IPC-B-52 Process Qualification Test Vehicle, which will serve as a user guideline for the IPC-B-52 SIR test board. The task group anticipates balloting IPC-9202 in Q3 2011.

The 5-32E Conductive Anodic Filament (CAF) Task Group successfully advanced the TM 2.6.25 CAF test method to its final draft. The group voted to submit the final draft to the 7-11 Test Methods Subcommittee for insertion into TM-650, Test Methods Manual to replace the current release. The group also worked on a first draft of the IPC-9691A User’s Guide.

The 5-33A Conformal Coating Task Group met for the first time in several years with the group opening up IPC-CC-830B, Qualification and Performance of Electrical Insulation Compound for Printed Wiring Assemblies, for revision. The task group discussed the process for developing and accepting new categories of conformal coating materials for the document, including vapor deposited coatings.

The 5-33C Conformal Coating Handbook Task Group continued with the development of a first working draft for Revision A to IPC-HDBK-830, Guidelines for Design, Selection and Application of Conformal Coatings. The task group outlined plans for new sections highlighting the application of conformal coatings in the automotive and medical industries, and discussed section updates for environmental health and safety guidance on conformal coatings.

The IPC 5-33F Potting and Encapsulation Task Group reviewed edits to the working draft for IPC-HDBK-850, a guideline on potting and encapsulation materials and processes. The task group also reviewed terms and definitions for potting and encapsulation as well as all section submissions on the various processes for the materials. The task group will be reviewing and approving photographs and illustrations of materials, processes and equipment for inclusion in the document in Q2 2011.

For more information on IPC standards activities, visit the committee home pages or the status of standardization or e-mail answers@ipc.org.

 

3 Comments

  1. Posted June 23, 2011 at 1:01 pm | Permalink

    Thanks for the thorough post… it was very helpful.

  2. Posted June 23, 2011 at 2:32 pm | Permalink

    Thanks Elizabeth! And thanks to ACDI for your membership in IPC!

  3. Jared
    Posted July 6, 2011 at 12:04 pm | Permalink

    Conformal coatings provide a printed circuit board

    coating that protects from service enviroments, help mitigate tin whiskers, and cure in shadowed areas.

    They are electrically insulated so they can be applied over the entire PCB surface or in select areas to

    provide protection from service environments.


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