Deadline May 2: Call for Participation for IPC Midwest Conference & Exhibition

Event takes place September 21–22, 2011 at the Renaissance Schaumburg Hotel & Convention Center, Schaumburg, IL

Design, fabrication, assembly and test all contribute to the reliability of printed board assemblies. The IPC Midwest Technical Conference is seeking technical experts to make presentations on how all of these process steps enhance or detract from printed board assembly reliability.

Benefits to You and Your Company

You — and your company — will be included in the promotion of this event, which reaches tens of thousands of electronics industry contacts online and through direct mail. In addition, your inclusion in the conference proceedings results in additional visibility for months or years after the event. When conventional marketing budgets are cut, this is a terrific way to promote your expertise and a new channel to communicate with your audience — at virtually no cost.

Conference speakers and session leaders will receive full conference admission and access to the Conference Proceedings at no charge.

Technical Presentations are sought in the following topic areas:

  • AOI
  • Assembly
  • Cleaning and Residues
  • Cleanliness Testing
  • Design for Manufacturability
  • Design for Reliability
  • Design for Test           
  • Flexible Circuitry
  • Handling and Storage
  • ICT
  • Incoming Inspection
  • Interconnection Reliability
  • Moisture Sensitivity
  • Pick and Place
  • Post Coating  
  • Printing/Jetting
  • Reflow and Wave Soldering
  • Reliability
  • Selective Soldering
  • Solderability
  • Test and Inspection
  • Tin Whiskers Risk Mitigation

Technical Presentations

Abstracts for unpublished work must be submitted by Monday, May 2, 2011. These should detail case histories, field data, new technologies or innovations or research and findings. Abstracts should summarize the problems and resolutions, procedures used, results of experiments and benefits to the industry. Formal papers are not required but will be included in the proceedings.

Oral presentations will be limited to 20 minutes, plus an additional 10 minutes for questions and answers. Presentations must be noncommercial in nature, focusing on technology rather than a company’s product and must not have been previously presented.

If selected, speakers must provide an electronic copy of their presentation slides and an executive summary of the topic. Presentation slides must be submitted by Friday, August 5, 2011.

For more information about participation, please contact John Perry, technical conference director, at +1 847-597-2818 or Toya Richardson, at +1 847-597-2825.

Submit your presentation abstract.

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