Polishing up the Cleaning Handbook

Contamination and foreign matter are very dirty words when they are used in conjunction with electronic assemblies. IPC committee members are currently cleaning up the last details of a handbook that will help eliminate problems during the assembly process.
The 5-31 IPC Cleaning and Alternatives Subcommittee has been defining the best practices for removing contamination from circuit card assemblies. A final working draft of the IPC Cleaning Handbook will be released to the industry for review by January, according to Dr. Mike Bixenman, chief technology officer at Kyzen Corp. and chairman for the subcommittee. He has worked in the electronics cleaning for the past 30 years and is one of the foremost authorities on the subject.
Some chapters are entirely new, covering aqueous, semi-aqueous and solvent based cleaning.  The next Cleaning Handbook subcommittee meeting is scheduled in conjunction with the High Performance Cleaning and Coating Conference. It’s on Tuesday, November 16, 2010 from 5:00-7:00 pm at the Renaissance Hotel in Schaumburg, Ill.

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