Updates from IPC Design, Data Transfer and Documentation Committees

What progress are the IPC committees making? Learn more in the area of PCB design, data transfer and documentation from the Electronics Midwest standards development meetings. Interested in joining a committee? Send an e-mail to answers@ipc.org.


The IPC 1-10c Test Coupon and Artwork Generation Task Group reviewed a future addendum to IPC-2221A, Generic Standard on Printed Board Design. The addendum will present an “overhaul” of existing test coupon designs currently provided in section 12.4 of IPC-2221A. To date, a new A/B-R plated-through hole evaluation coupon design has been approved as a replacement for the legacy A and B and A/B test coupon designs. In addition, the task group reviewed proposed design changes for the “D” interconnect resistance coupon, the “E” insulation resistance coupon, the “S” plated-hole solderability test coupon, and a new “P” peel strength evaluation coupon.


The 2-10 Data Generation and Transfer Committee and 2-16 Product Data Description (Laminar View) Subcommittee discussed revision A of IPC-2581, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology. Recommendations were made to move from XML format to UML data modeling format. A collaborative effort with the Electronic Documentation Committee ensured that all the requirements needed between design and manufacturing were addressed. The group planned their activity for 2011 in Phoenix to continue development of the A revision of IPC-2584.


Prior to the release of IPC-1751A, Generic Requirements for Declaration Process Management, the 2-18 Supplier Declaration Committee decided to focus on the data exchange standards and not develop user tools. To support the development of compatible user tools, the committee is developing criteria that third party solution providers must meet in order to be compatible with IPC-1751A and IPC-1752A. During the meeting, the committee reviewed previously developed criteria and discussed the need for additional criteria. The committee will continue to work on identifying criteria, with the intent of implementing a certification program as soon as possible.

The 2-18b Materials Declaration Task Group discussed a variety of issues with IPC-1752A, Materials Declaration Management, including the need for additional data fields, adding REACH authorizations, and the use of binary files to address possible limitations with the standard. The group also discussed the inclusion of a conflict minerals query. The group decided that it was premature to request data on conflict minerals and postponed the discussion until draft regulations are published.

The 2-18c Laminate Declaration Task Group reviewed the status of IPC-1753 and determined the UML model conditions for that particular document. After a thorough review, it became apparent that the mixing and matching of material in new complex designs, requires that additional characteristics should be included in the model for flex material, ceramic material, and even silicon. The data model will be updated and the document will be reviewed at the interim standards meetings in January 2011.

The 2-18f Shipping, Packing and Packaging Materials Declaration Task Group drafted IPC-1758, Declaration Requirements for Shipping, Packing and Packaging Materials. IPC-1758 is part of the 175x family of data exchange standards that will help exchange data on the materials in packaging materials. The group will finalize the draft standard by the end of the year and intends to distribute for industry comment soon after.


The 2-40 Electronic Documentation Technology Committee discussed the relationship of the IPC-261X and IPC-258X series of documents. The first relates to documentation, either hard copy or electronic, while the second relates to the computer format for those characteristics which are handled by the 2-10 committee. Attendees took the outline developed at an interim meeting in Marlborough, Mass. and organized the structure for IPC-2616. This information will be compared to IPC-2586 so that every requirement has a corresponding software XML home.


The D-20 High Speed/High Frequency Committee discussed the status of design guidelines for HS/HF such as IPC-2251, IPC-2252 and IPC-2141A. IPC does not have a corresponding IPC-2220 series design requirements document for HS/HF. It was noted that many OEMs currently have their own set of internal design requirements for HS/HF printed boards. The committee agreed to develop an industry survey to determine if the current IPC design guidelines should be revised, or if an IPC-2220 series requirements document is desired.

The D-22 High Speed/High Frequency Board Performance Subcommittee continued its review of comments to the final draft of IPC-6018B, Qualification and Performance Specification for High Speed/High Frequency Printed Boards. The subcommittee will review comments through Web conferences, and expects to ballot the revision in December 2010.


The D-23 High Speed/High Frequency Base Materials Subcommittee reviewed proposed templates for new material specification (slash) sheets in the forthcoming IPC-4103A. With the main body of IPC-4103 having already gone through a revision process, the subcommittee considered several template concepts for these specification sheets, including formatting based on dielectric constant and loss.

The D-24b Propagation Loss Test Methods Task Group considered updating IPC-TM-650, Method, Test Methods to Determine the Amount of Signal Loss on Printed Boards by replacing the existing root impulse energy (RIE) methodology with a lower cost loss methodology known as SET2DIL, developed by Intel Corp. A round robin test program is being conducted to validate the use of the methodology.

One Comment

  1. Posted January 15, 2011 at 11:15 am | Permalink

    This some fascinating information. I provide designing solutions and I think some of my visitors would find this very informative.

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