Defect of the Month from NPL and IPC: Solder Wicking and Reflow

Fine pitch components, convection reflow with nitrogen, and vapor phase reflow can all add up to solder wicking where the solder is drawn to either the component terminations or the pads. Industry expert Bob Willis explains the causes in this video from the National Physical Laboratory Defect Database.

The defect database allows engineers to search through a range of defects covering components, printed circuit boards, solder joints and assembly problems. The aim is to add more defects each month to complement the online submissions with further support from the industry to make this a global resource to industry. It is available at no charge to allow engineers to submit defects online with full details and solutions to current problems.

Additional defect videos and more are available on the IPC YouTube Channel.

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