IPC standards committee updates: Assembly & Joining/Product Assurance; Product Reliability and Cleaning/Coating

Assembly and Joining/Product Assurance

The 5-22a Task Group (J-STD-001, Requirements for Soldered Electrical & Electronic Assemblies) and the 7-31b Task Group (IPC-A-610, Acceptability of Electronic Assemblies) had a joint meeting to celebrate publication of Revision E of both of these standards.

The 5-22as Task Group continued work on J-STD-001ES, Space Applications Electronic Hardware Addendum, to J-STD-001E. A second ballot is being prepared.

The 5-22bt J-STD-001 Technical Training Task Group and the 7-31bt IPC-A-610 Technical Training Task Group reviewed and approved a number of curriculum updates.

The 5-23a Printed Wiring Board Solderability Specification Task Group is actively revising J-STD-003, Solderability Tests for Printed Board to its C revision. Activities are centered on: 1) Establishing wetting balance testing as a hard requirement test and property (with no exceptions); 2) Improving the solder float testing to more consistently provide data; 3) Accounting for the baking process requirements within the in-development storage and handling document (IPC-1601) and its effects on board solderability and 4) Implementing a solder spread test.

The 5-23b Component and Wire Solderability Specification Task Group reviewed the preconditioning round robin test. This is the last work to be completed prior to J-STD-002D, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires revision being generated. Format and structure finalization of a merged D revision document that contains both IPC-J-STD-002 and the JEDEC22-102B was also discussed. All of the work on the new D revision is targeted for completion by late September 2010 at Electronics Midwest.

The 5-24a Flux Specifications Task Group is vigorously pushing Amendment 1 to J-STD-004B, Requirements for Soldering Fluxes. The group proposed a draft that will be circulated to the all task group members. With this acceptance, the Final Draft of Amendment 1 will be sent out for comments and eventual balloting.

The 5-24b Solder Paste Task Group finished their Final Draft work on J-STD-005A, Requirements for Soldering Pastes. The last major item for the task group to complete is a round robin test program to generate a correct solder particle size distribution for the manufacture of solder pastes. The interested parties in the round robin will follow up by teleconference.

The 5-24f Underfill Adhesives for Flip Chip Applications Task Group examined J-STD-030, Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages, to begin a cross comparison (GAP analysis). Discussion also occurred on “upgrading” the guideline to a full specification. A TAEC PIN will be submitted for ballot on the A revision that includes a new title, Design, Selection and Process Implementation for Underfill Materials.

The 7-31f Wire Harness Acceptability Task Group worked on Revision B to IPC/WHMA-A-620, Requirements and Acceptance of Cable and Wire Harness Assemblies. The task group also worked on a companion document, IPC-HDBK-620.

The 7-31j Requirements for Structural Enclosure Task Group, developing IPC-A-630 Guidelines for Final Finishes of Electronic Enclosures, had increased participation and is making progress on a draft.

The 7-35 Assembly and Joining Handbook Committee resolved nearly all action items and comments. The  handbook is being prepared for a summer 2010 ballot.

Product Reliability

The 6-10c Plated-Through Via (PTV) Reliability Task Group discussed “eyebrow” laminate cracks that occur between double blind via constructions in printed boards. The task group discussed the distinction between single and dual eyebrow cracks. The task group also reviewed a presentation for a potential new IPC-TM-650 Test Method, Cyclic Time to Degradation (cT260 or cT288) Test Protocol for Evaluation of Printed Board Base Materials for Suitability for Tin-lead or Lead-free Solder Assembly.

The 6-10d Surface Mount Attachment Reliability Test Methods Task Group reviewed industry comments to the Final Draft circulation of IPC-9708, Test Methods for Characterization of PCB Pad Cratering. The task group expects to prepare IPC-9708 for ballot later this summer.

Cleaning and Coating

The 5-31 Cleaning and Alternatives Subcommittee has made significant progress on the project to combine four cleaning handbooks into the single IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.

The 5-32e Conductive Anodic Filament (CAF) Task Group reviewed and updated both the CAF test method (TM 2.6.25) for A revision and the user’s guide for CAF testing (IPC-9691A) for either an Amendment or B revision.

The 5-33b Solder Mask Performance Task Group met with the D-13b Flexible Covercoat Materials Task Group to review proposed changes to the working draft of IPC-SM-840E, Qualification and Performance Specification of Permanent Solder Mask. Revision E will incorporate flexible cover materials that perform the same function as solder masks.

The 5-33c Conformal Coating Handbook Task Group continued with the development of a First Working Draft for Revision A to IPC-HDBK-830, Guidelines for Design, Selection and Application of Conformal Coatings. The task group outlined plans for new sections highlighting the application of conformal coatings in the automotive and medical industries.

The new 5-33f Potting and Encapsulation Task Group reviewed a “strawman” draft for IPC-HDBK-850, a guideline on potting and encapsulation materials and processes.  The task group reviewed terms and definitions for potting and encapsulation as well as sections on the various processes for the materials.

IPC Subcommittee 5-41 is making good progress with a major update to IPC-9850, Surface Mount Placement Equipment Characterization. Significant changes are expected because newer pick and place equipment combines multiple functions into a single platform. These capabilities did not exist when the original document was published.

For committee meeting schedules at Electronics Midwest, visit www.electronicsmidwest.com.

2 Comments

  1. Baltimore
    Posted August 24, 2010 at 9:39 am | Permalink

    i hope this affects the overall performance of IPC. goodluck!

  2. Posted October 7, 2010 at 5:02 am | Permalink

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